Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Thin Films--stresses and Mechanical Properties XI
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Publisher:
ISBN:
Category : Thin films
Languages : en
Pages : 480
Book Description
Metallic Films for Electronic, Optical and Magnetic Applications
Author: Katayun Barmak
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Publisher: Woodhead Publishing
ISBN: 085709629X
Category : Technology & Engineering
Languages : en
Pages : 671
Book Description
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. - Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy - Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations - Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Mechanical Properties and Deformation Behavior of Materials Having Ultra-Fine Microstructures
Author: Michael Anthony Nastasi
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Publisher: Springer Science & Business Media
ISBN: 9780792321958
Category : Science
Languages : en
Pages : 646
Book Description
This book focuses on the emerging class of new materials characterized by ultra-fine microstrucures. The NATO ASI which produced this book was the first international scientific meeting devoted to a discussion of the mechanical properties and deformation behavior of materials having grain sizes down to a few nanometers. Topics covered include superplasticity, tribology, and the supermodulus effect. Review chapters cover a variety of other themes including synthesis, characterization, thermodynamic stability, and general physical properties. Much of the work is concerned with the issue of how far conventional techniques and concepts can be extended toward atomic scale probing. Another key issue concerns the structure of nanocrystalline materials, in particular, what is the structure and composition of the internal boundaries. These ultra-fine microstructures have proved to challenge even the finest probes that the materials science community has today.
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Surface Properties And Engineering Of Complex Intermetallics
Author: Esther Belin-ferre
Publisher: World Scientific
ISBN: 9814465011
Category : Science
Languages : en
Pages : 408
Book Description
This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.
Publisher: World Scientific
ISBN: 9814465011
Category : Science
Languages : en
Pages : 408
Book Description
This book is the third in a series of 4 books issued yearly as a deliverable of the research school established within the European Network of Excellence CMA (for Complex Metallic Alloys). It is written by reputed experts in the fields of surface physics and chemistry, metallurgy and process engineering, combining expertise found inside as well as outside the network.The CMA network focuses on the huge group of largely unknown multinary alloys and compounds formed with crystal structures based on giant unit cells containing clusters, with many tens or up to more than thousand atoms per unit cell. In these phases, for many phenomena, the physical length scales are substantially smaller than the unit-cell dimension. Hence, these materials offer unique combinations of properties, which are mutually excluded in conventional materials: metallic electric conductivity combined with low thermal conductivity, combination of good light absorption with high-temperature stability, combination of high metallic hardness with reduced wetting by liquids, electrical and thermal resistance tuneable by composition variation, excellent resistance to corrosion, reduced cold-welding and adhesion, enhanced hydrogen storage capacity and light absorption, etc.The series of books will concentrate on: development of fundamental knowledge with the aim of understanding materials phenomena, technologies associated with the production, transformation and processing of knowledge-based multifunctional materials, surface engineering, support for new materials development and new knowledge-based higher performance materials for macro-scale applications.
The Materials Science of Thin Films
Author: Milton Ohring
Publisher: Academic Press
ISBN: 9780125249904
Category : Science
Languages : en
Pages : 744
Book Description
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Publisher: Academic Press
ISBN: 9780125249904
Category : Science
Languages : en
Pages : 744
Book Description
Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Handbook of Micro/Nano Tribology
Author: Bharat Bhushan
Publisher: CRC Press
ISBN: 9781420050493
Category : Technology & Engineering
Languages : en
Pages : 884
Book Description
This second edition of Handbook of Micro/Nanotribology addresses the rapid evolution within this field, serving as a reference for the novice and the expert alike. Two parts divide this handbook: Part I covers basic studies, and Part II addresses design, construction, and applications to magnetic storage devices and MEMS. Discussions include: surface physics and methods for physically and chemically characterizing solid surfaces roughness characterization and static contact models using fractal analysis sliding at the interface and friction on an atomic scale scratching and wear as a result of sliding nanofabrication/nanomachining as well as nano/picoindentation lubricants for minimizing friction and wear surface forces and microrheology of thin liquid films measurement of nanomechanical properties of surfaces and thin films atomic-scale simulations of interfacial phenomena micro/nanotribology and micro/nanomechanics of magnetic storage devices This comprehensive book contains 16 chapters contributed by more than 20 international researchers. In each chapter, the presentation starts with macroconcepts and then lead to microconcepts. With more than 500 illustrations and 50 tables, Handbook of Micro/Nanotribology covers the range of relevant topics, including characterization of solid surfaces, measurement techniques and applications, and theoretical modeling of interfaces. What's New in the Second Edition? New chapters on: AFM instrumentation Surface forces and adhesion Design and construction of magnetic storage devices Microdynamical devices and systems Mechanical properties of materials in microstructure Micro/nanotribology and micro/nanomechanics of MEMS devices
Publisher: CRC Press
ISBN: 9781420050493
Category : Technology & Engineering
Languages : en
Pages : 884
Book Description
This second edition of Handbook of Micro/Nanotribology addresses the rapid evolution within this field, serving as a reference for the novice and the expert alike. Two parts divide this handbook: Part I covers basic studies, and Part II addresses design, construction, and applications to magnetic storage devices and MEMS. Discussions include: surface physics and methods for physically and chemically characterizing solid surfaces roughness characterization and static contact models using fractal analysis sliding at the interface and friction on an atomic scale scratching and wear as a result of sliding nanofabrication/nanomachining as well as nano/picoindentation lubricants for minimizing friction and wear surface forces and microrheology of thin liquid films measurement of nanomechanical properties of surfaces and thin films atomic-scale simulations of interfacial phenomena micro/nanotribology and micro/nanomechanics of magnetic storage devices This comprehensive book contains 16 chapters contributed by more than 20 international researchers. In each chapter, the presentation starts with macroconcepts and then lead to microconcepts. With more than 500 illustrations and 50 tables, Handbook of Micro/Nanotribology covers the range of relevant topics, including characterization of solid surfaces, measurement techniques and applications, and theoretical modeling of interfaces. What's New in the Second Edition? New chapters on: AFM instrumentation Surface forces and adhesion Design and construction of magnetic storage devices Microdynamical devices and systems Mechanical properties of materials in microstructure Micro/nanotribology and micro/nanomechanics of MEMS devices
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Encyclopedia of Thermal Stresses
Author: Richard B. Hetnarski
Publisher: Springer
ISBN: 9789400727380
Category : Science
Languages : en
Pages : 0
Book Description
The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
Publisher: Springer
ISBN: 9789400727380
Category : Science
Languages : en
Pages : 0
Book Description
The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
Elements of Strength of Materials
Author: Stephen Timoshenko
Publisher:
ISBN:
Category : Strength of materials
Languages : en
Pages : 400
Book Description
Publisher:
ISBN:
Category : Strength of materials
Languages : en
Pages : 400
Book Description