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Author: Yong Zhan
Publisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
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Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author: Yong Zhan
Publisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
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Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Author: Rainer Leupers
Publisher: Springer Science & Business Media
ISBN: 1441961755
Category : Technology & Engineering
Languages : en
Pages : 343
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Book Description
Simulation of computer architectures has made rapid progress recently. The primary application areas are hardware/software performance estimation and optimization as well as functional and timing verification. Recent, innovative technologies such as retargetable simulator generation, dynamic binary translation, or sampling simulation have enabled widespread use of processor and system-on-chip (SoC) simulation tools in the semiconductor and embedded system industries. Simultaneously, processor and SoC simulation is still a very active research area, e.g. what amounts to higher simulation speed, flexibility, and accuracy/speed trade-offs. This book presents and discusses the principle technologies and state-of-the-art in high-level hardware architecture simulation, both at the processor and the system-on-chip level.
Author: Marilyn Wolf
Publisher: Newnes
ISBN: 0124104886
Category : Computers
Languages : en
Pages : 507
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Book Description
High-Performance Embedded Computing, Second Edition, combines leading-edge research with practical guidance in a variety of embedded computing topics, including real-time systems, computer architecture, and low-power design. Author Marilyn Wolf presents a comprehensive survey of the state of the art, and guides you to achieve high levels of performance from the embedded systems that bring these technologies together. The book covers CPU design, operating systems, multiprocessor programs and architectures, and much more. Embedded computing is a key component of cyber-physical systems, which combine physical devices with computational resources for control and communication. This revised edition adds new content and examples of cyber-physical systems throughout the book, including design methodologies, scheduling, and wide-area CPS to illustrate the possibilities of these new systems. - Revised and updated with coverage of recently developed consumer electronics architectures and models of computing - Includes new VLIW processors such as the TI Da Vinci, and CPU simulation - Learn model-based verification and middleware for embedded systems - Supplemental material includes lecture slides, labs, and additional resources
Author: Marta Rencz
Publisher: Springer Nature
ISBN: 3030861740
Category : Technology & Engineering
Languages : en
Pages : 389
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Book Description
This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed to understand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Author:
Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397
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Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Author: Nima Aghaee Ghaleshahi
Publisher: Linköping University Electronic Press
ISBN: 9176859495
Category :
Languages : en
Pages : 219
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Book Description
Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
Author: Anil Leblebici
Publisher: Springer
ISBN: 3319991094
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
This book presents the overall vision and research outcomes of Nano-Tera.ch, which is a landmark Swiss federal program to advance engineering system and device technologies with applications to Health and the Environment, including smart Energy generation and consumption. The authors discuss this unprecedented nation-wide program, with a lifetime of almost 10 years and a public funding of more than 120 MCHF, which helped to position Switzerland at the forefront of the research on multi-scale engineering of complex systems and networks, and strongly impacted the Swiss landscape in Engineering Sciences.
Author: Eugene John
Publisher: CRC Press
ISBN: 1351835416
Category : Technology & Engineering
Languages : en
Pages : 369
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Book Description
Which came first, the system or the chip? While integrated circuits enable technology for the modern information age, computing, communication, and network chips fuel it. As soon as the integration ability of modern semiconductor technology offers presents opportunities, issues in power consumption, reliability, and form-factor present challenges. The demands of emerging software applications can only be met with unique systems and chips. Drawing on contributors from academia, research, and industry, Unique Systems and Chips explores unique approaches to designing future computing and communication chips and systems. The book focuses on specialized hardware and systems as opposed to general-purpose chips and systems. It covers early conception and simulation, mid-development, application, testing, and performance. The chapter authors introduce new ideas and innovations in unique aspects of chips and system design, then go on to provide in-depth analysis of these ideas. They explore ways in which these chips and systems may be used in further designs or products, spurring innovations beyond the intended scopes of those presented. International in flavor, the book brings industrial and academic perspectives into focus by presenting the full spectrum of applications of chips and systems.
Author: Nikolaos Voros
Publisher: Springer Science & Business Media
ISBN: 9400714882
Category : Technology & Engineering
Languages : en
Pages : 341
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Book Description
VLSI 2010 Annual Symposium will present extended versions of the best papers presented in ISVLSI 2010 conference. The areas covered by the papers will include among others: Emerging Trends in VLSI, Nanoelectronics, Molecular, Biological and Quantum Computing. MEMS, VLSI Circuits and Systems, Field-programmable and Reconfigurable Systems, System Level Design, System-on-a-Chip Design, Application-Specific Low Power, VLSI System Design, System Issues in Complexity, Low Power, Heat Dissipation, Power Awareness in VLSI Design, Test and Verification, Mixed-Signal Design and Analysis, Electrical/Packaging Co-Design, Physical Design, Intellectual property creating and sharing.
Author: Hao Yu
Publisher: World Scientific
ISBN: 9814699039
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
