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Author: Lian-Tuu Yeh
Publisher:
ISBN: 9780791887264
Category : Electronic apparatus and appliances
Languages : en
Pages : 0
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Book Description
Author: Lian-Tuu Yeh
Publisher:
ISBN: 9780791887264
Category : Electronic apparatus and appliances
Languages : en
Pages : 0
Get Book Here
Book Description
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Yogendra Joshi
Publisher: Springer Science & Business Media
ISBN: 1441971246
Category : Science
Languages : en
Pages : 635
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Book Description
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author: C.J. Hoogendoorn
Publisher: Springer Science & Business Media
ISBN: 9401110824
Category : Technology & Engineering
Languages : en
Pages : 334
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Book Description
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
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Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Ron Legarski
Publisher: SolveForce
ISBN:
Category : Science
Languages : en
Pages : 585
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Book Description
Explore the fascinating world of boron, one of the most versatile and impactful elements shaping modern technology and industry. "Boron: From Discovery to Modern Energy Applications" is a comprehensive guide to understanding boron’s journey from its discovery to its wide-ranging applications in fields such as energy storage, medicine, aerospace, agriculture, and materials science. This book dives deep into the chemical properties of boron, its extraction processes, and its industrial significance, while providing a forward-looking exploration of its potential to revolutionize key industries. Each chapter offers detailed insights into how boron is being used to address some of the world’s most pressing challenges. From boron-doped materials that enhance the performance of electric vehicles and renewable energy systems, to boron-based cancer treatments that are saving lives, this book uncovers the profound ways in which boron is influencing the future of science and technology. In addition to detailed case studies, this book features contributions from leading researchers and innovators, profiles of key figures in boron technology, and in-depth analysis of boron’s role in global trade and sustainable development. Whether you're a scientist, engineer, industry professional, or simply curious about the hidden power of boron, this book serves as an essential resource for understanding the critical role this element plays in the technological advancements of today and tomorrow. With comprehensive appendices, including data tables, conferences, and further reading resources, "Boron: From Discovery to Modern Energy Applications" is a must-read for anyone interested in how this often-overlooked element is driving innovation across industries.
Author: Clemens J.M. Lasance
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550
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Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Author: Kaveh Azar
Publisher: Advanced Thermal Solutions
ISBN: 0984627928
Category : Science
Languages : en
Pages : 182
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Book Description
The complete editorial contents of Qpedia Thermal 4, Issues 1 - 12 features 48 in-depth articles that discuss critical case studies, calculations and analysis for thermal engineering professionals and academia.
Author: David Reay
Publisher: Butterworth-Heinemann
ISBN: 0080982794
Category : Technology & Engineering
Languages : en
Pages : 280
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Book Description
Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications
Author: Younes Shabany
Publisher: CRC Press
ISBN: 1439814686
Category : Science
Languages : en
Pages : 526
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Book Description
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
