Author: H. S. Lee
Publisher: John Wiley & Sons
ISBN: 1118004701
Category : Science
Languages : en
Pages : 656
Book Description
Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
Thermal Design
Author: H. S. Lee
Publisher: John Wiley & Sons
ISBN: 1118004701
Category : Science
Languages : en
Pages : 656
Book Description
Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
Publisher: John Wiley & Sons
ISBN: 1118004701
Category : Science
Languages : en
Pages : 656
Book Description
Thermal Design: Heat Sinks, Thermoelectrics, Heat Pipes, Compact Heat Exchangers, and Solar Cells, Second Edition, is a significantly updated new edition which now includes a chapter on thermoelectrics It covers thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems. These devices are becoming increasingly important and fundamental in thermal design across such diverse areas as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. The underlying concepts in this book cover the understanding of the physical mechanisms of the thermal devices with the essential formulas and detailed derivations, and also the design of the thermal devices in conjunction with mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. This new edition includes more examples, problems and tutorials, and a solutions manual is available on a companion website.
Handbook of Applied Thermal Design
Author: Eric C. Guyer
Publisher: CRC Press
ISBN: 9781560328117
Category : Technology & Engineering
Languages : en
Pages : 710
Book Description
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Publisher: CRC Press
ISBN: 9781560328117
Category : Technology & Engineering
Languages : en
Pages : 710
Book Description
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Thermal Design and Optimization
Author: Adrian Bejan
Publisher: John Wiley & Sons
ISBN: 9780471584674
Category : Technology & Engineering
Languages : en
Pages : 562
Book Description
A comprehensive and rigorous introduction to thermal system designfrom a contemporary perspective Thermal Design and Optimization offers readers a lucid introductionto the latest methodologies for the design of thermal systems andemphasizes engineering economics, system simulation, andoptimization methods. The methods of exergy analysis, entropygeneration minimization, and thermoeconomics are incorporated in anevolutionary manner. This book is one of the few sources available that addresses therecommendations of the Accreditation Board for Engineering andTechnology for new courses in design engineering. Intended forclassroom use as well as self-study, the text provides a review offundamental concepts, extensive reference lists, end-of-chapterproblem sets, helpful appendices, and a comprehensive case studythat is followed throughout the text. Contents include: * Introduction to Thermal System Design * Thermodynamics, Modeling, and Design Analysis * Exergy Analysis * Heat Transfer, Modeling, and Design Analysis * Applications with Heat and Fluid Flow * Applications with Thermodynamics and Heat and Fluid Flow * Economic Analysis * Thermoeconomic Analysis and Evaluation * Thermoeconomic Optimization Thermal Design and Optimization offers engineering students,practicing engineers, and technical managers a comprehensive andrigorous introduction to thermal system design and optimizationfrom a distinctly contemporary perspective. Unlike traditionalbooks that are largely oriented toward design analysis andcomponents, this forward-thinking book aligns itself with anincreasing number of active designers who believe that moreeffective, system-oriented design methods are needed. Thermal Design and Optimization offers a lucid presentation ofthermodynamics, heat transfer, and fluid mechanics as they areapplied to the design of thermal systems. This book broadens thescope of engineering design by placing a strong emphasis onengineering economics, system simulation, and optimizationtechniques. Opening with a concise review of fundamentals, itdevelops design methods within a framework of industrialapplications that gradually increase in complexity. Theseapplications include, among others, power generation by large andsmall systems, and cryogenic systems for the manufacturing,chemical, and food processing industries. This unique book draws on the best contemporary thinking aboutdesign and design methodology, including discussions of concurrentdesign and quality function deployment. Recent developments basedon the second law of thermodynamics are also included, especiallythe use of exergy analysis, entropy generation minimization, andthermoeconomics. To demonstrate the application of important designprinciples introduced, a single case study involving the design ofa cogeneration system is followed throughout the book. In addition, Thermal Design and Optimization is one of the best newsources available for meeting the recommendations of theAccreditation Board for Engineering and Technology for more designemphasis in engineering curricula. Supported by extensive reference lists, end-of-chapter problemsets, and helpful appendices, this is a superb text for both theclassroom and self-study, and for use in industrial design,development, and research. A detailed solutions manual is availablefrom the publisher.
Publisher: John Wiley & Sons
ISBN: 9780471584674
Category : Technology & Engineering
Languages : en
Pages : 562
Book Description
A comprehensive and rigorous introduction to thermal system designfrom a contemporary perspective Thermal Design and Optimization offers readers a lucid introductionto the latest methodologies for the design of thermal systems andemphasizes engineering economics, system simulation, andoptimization methods. The methods of exergy analysis, entropygeneration minimization, and thermoeconomics are incorporated in anevolutionary manner. This book is one of the few sources available that addresses therecommendations of the Accreditation Board for Engineering andTechnology for new courses in design engineering. Intended forclassroom use as well as self-study, the text provides a review offundamental concepts, extensive reference lists, end-of-chapterproblem sets, helpful appendices, and a comprehensive case studythat is followed throughout the text. Contents include: * Introduction to Thermal System Design * Thermodynamics, Modeling, and Design Analysis * Exergy Analysis * Heat Transfer, Modeling, and Design Analysis * Applications with Heat and Fluid Flow * Applications with Thermodynamics and Heat and Fluid Flow * Economic Analysis * Thermoeconomic Analysis and Evaluation * Thermoeconomic Optimization Thermal Design and Optimization offers engineering students,practicing engineers, and technical managers a comprehensive andrigorous introduction to thermal system design and optimizationfrom a distinctly contemporary perspective. Unlike traditionalbooks that are largely oriented toward design analysis andcomponents, this forward-thinking book aligns itself with anincreasing number of active designers who believe that moreeffective, system-oriented design methods are needed. Thermal Design and Optimization offers a lucid presentation ofthermodynamics, heat transfer, and fluid mechanics as they areapplied to the design of thermal systems. This book broadens thescope of engineering design by placing a strong emphasis onengineering economics, system simulation, and optimizationtechniques. Opening with a concise review of fundamentals, itdevelops design methods within a framework of industrialapplications that gradually increase in complexity. Theseapplications include, among others, power generation by large andsmall systems, and cryogenic systems for the manufacturing,chemical, and food processing industries. This unique book draws on the best contemporary thinking aboutdesign and design methodology, including discussions of concurrentdesign and quality function deployment. Recent developments basedon the second law of thermodynamics are also included, especiallythe use of exergy analysis, entropy generation minimization, andthermoeconomics. To demonstrate the application of important designprinciples introduced, a single case study involving the design ofa cogeneration system is followed throughout the book. In addition, Thermal Design and Optimization is one of the best newsources available for meeting the recommendations of theAccreditation Board for Engineering and Technology for more designemphasis in engineering curricula. Supported by extensive reference lists, end-of-chapter problemsets, and helpful appendices, this is a superb text for both theclassroom and self-study, and for use in industrial design,development, and research. A detailed solutions manual is availablefrom the publisher.
Thermal Design of Electronic Equipment
Author: Ralph Remsburg
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Publisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Design for Thermal Stresses
Author: Randall F. Barron
Publisher: John Wiley & Sons
ISBN: 1118094530
Category : Science
Languages : en
Pages : 464
Book Description
The tools engineers need for effective thermal stress design Thermal stress concerns arise in many engineering situations, from aerospace structures to nuclear fuel rods to concrete highway slabs on a hot summer day. Having the tools to understand and alleviate these potential stresses is key for engineers in effectively executing a wide range of modern design tasks. Design for Thermal Stresses provides an accessible and balanced resource geared towards real-world applications. Presenting both the analysis and synthesis needed for accurate design, the book emphasizes key principles, techniques, and approaches for solving thermal stress problems. Moving from basic to advanced topics, chapters cover: Bars, beams, and trusses from a "strength of materials" perspective Plates, shells, and thick-walled vessels from a "theory of elasticity" perspective Thermal buckling in columns, beams, plates, and shells Written for students and working engineers, this book features numerous sample problems demonstrating concepts at work. In addition, appendices include important SI units, relevant material properties, and mathematical functions such as Bessel and Kelvin functions, as well as characteristics of matrices and determinants required for designing plates and shells. Suitable as either a working reference or an upper-level academic text, Design for Thermal Stresses gives students and professional engineers the information they need to meet today's thermal stress design challenges.
Publisher: John Wiley & Sons
ISBN: 1118094530
Category : Science
Languages : en
Pages : 464
Book Description
The tools engineers need for effective thermal stress design Thermal stress concerns arise in many engineering situations, from aerospace structures to nuclear fuel rods to concrete highway slabs on a hot summer day. Having the tools to understand and alleviate these potential stresses is key for engineers in effectively executing a wide range of modern design tasks. Design for Thermal Stresses provides an accessible and balanced resource geared towards real-world applications. Presenting both the analysis and synthesis needed for accurate design, the book emphasizes key principles, techniques, and approaches for solving thermal stress problems. Moving from basic to advanced topics, chapters cover: Bars, beams, and trusses from a "strength of materials" perspective Plates, shells, and thick-walled vessels from a "theory of elasticity" perspective Thermal buckling in columns, beams, plates, and shells Written for students and working engineers, this book features numerous sample problems demonstrating concepts at work. In addition, appendices include important SI units, relevant material properties, and mathematical functions such as Bessel and Kelvin functions, as well as characteristics of matrices and determinants required for designing plates and shells. Suitable as either a working reference or an upper-level academic text, Design for Thermal Stresses gives students and professional engineers the information they need to meet today's thermal stress design challenges.
Introduction to Spacecraft Thermal Design
Author: Eric Silk
Publisher: Cambridge University Press
ISBN: 1107193796
Category : Science
Languages : en
Pages : 587
Book Description
Develop a fundamental understanding of heat transfer analysis techniques as applied to earth based spacecraft with this practical guide. Written in a tutorial style, this essential text provides a how-to manual tailored for those who wish to understand and develop spacecraft thermal analyses. Providing an overview of basic heat transfer analysis fundamentals such as thermal circuits, limiting resistance, MLI, environmental thermal sources and sinks, as well as contemporary space based thermal technologies, and the distinctions between design considerations inherent to room temperature and cryogenic temperature applications, this is the perfect tool for graduate students, professionals and academic researchers.
Publisher: Cambridge University Press
ISBN: 1107193796
Category : Science
Languages : en
Pages : 587
Book Description
Develop a fundamental understanding of heat transfer analysis techniques as applied to earth based spacecraft with this practical guide. Written in a tutorial style, this essential text provides a how-to manual tailored for those who wish to understand and develop spacecraft thermal analyses. Providing an overview of basic heat transfer analysis fundamentals such as thermal circuits, limiting resistance, MLI, environmental thermal sources and sinks, as well as contemporary space based thermal technologies, and the distinctions between design considerations inherent to room temperature and cryogenic temperature applications, this is the perfect tool for graduate students, professionals and academic researchers.
Thermal Design
Author: HoSung Lee
Publisher: John Wiley & Sons
ISBN: 1119685974
Category : Technology & Engineering
Languages : en
Pages : 932
Book Description
Thermal Design Discover a new window to thermal engineering and thermodynamics through the study of thermal design Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy — as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable. In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems — all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. Readers of the Second Edition of Thermal Design will also find: A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed More problems and examples to help clarify points throughout the book A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work A solutions manual provided on a companion website Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering.
Publisher: John Wiley & Sons
ISBN: 1119685974
Category : Technology & Engineering
Languages : en
Pages : 932
Book Description
Thermal Design Discover a new window to thermal engineering and thermodynamics through the study of thermal design Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy — as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable. In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems — all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space. Readers of the Second Edition of Thermal Design will also find: A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed More problems and examples to help clarify points throughout the book A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work A solutions manual provided on a companion website Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering.
Thermal Design of Buildings
Author: Phillip Jones
Publisher: The Crowood Press
ISBN: 1785008994
Category : Architecture
Languages : en
Pages : 421
Book Description
The way we heat, cool and ventilate our buildings is central to many of today's concerns, including providing comfortable, healthy and productive environments, using energy and materials efficiently, and reducing greenhouse gas emissions. As we drive towards a zero-carbon society, design solutions that combine architecture, engineering and the needs of the individual are increasingly being sought. Thermal Design of Buildings aims to provide an understanding from which such solutions can be developed, placing technological developments within the context of a wider world view of the built environment and energy systems, and an historical perspective of how buildings have responded to climate and sustainable development.
Publisher: The Crowood Press
ISBN: 1785008994
Category : Architecture
Languages : en
Pages : 421
Book Description
The way we heat, cool and ventilate our buildings is central to many of today's concerns, including providing comfortable, healthy and productive environments, using energy and materials efficiently, and reducing greenhouse gas emissions. As we drive towards a zero-carbon society, design solutions that combine architecture, engineering and the needs of the individual are increasingly being sought. Thermal Design of Buildings aims to provide an understanding from which such solutions can be developed, placing technological developments within the context of a wider world view of the built environment and energy systems, and an historical perspective of how buildings have responded to climate and sustainable development.
Thermal Design of Nuclear Reactors
Author: R. H. S. Winterton
Publisher: Elsevier
ISBN: 1483145247
Category : Technology & Engineering
Languages : en
Pages : 206
Book Description
Thermal Design of Nuclear Reactors
Publisher: Elsevier
ISBN: 1483145247
Category : Technology & Engineering
Languages : en
Pages : 206
Book Description
Thermal Design of Nuclear Reactors
Advanced Thermal Design of Electronic Equipment
Author: Ralph Remsburg
Publisher: Springer Science & Business Media
ISBN: 9780412122712
Category : Computers
Languages : en
Pages : 632
Book Description
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Publisher: Springer Science & Business Media
ISBN: 9780412122712
Category : Computers
Languages : en
Pages : 632
Book Description
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.