Author: Richard B. Hetnarski
Publisher: Springer Science & Business Media
ISBN: 1402092466
Category : Technology & Engineering
Languages : en
Pages : 579
Get Book Here
Book Description
The authors are pleased to present Thermal Stresses – Advanced Theory and Applications. This book will serve a wide range of readers, in particular, gr- uate students, PhD candidates, professors, scientists, researchers in various industrial and government institutes, and engineers. Thus, the book should be considered not only as a graduate textbook, but also as a reference handbook to those working or interested in areas of Applied Mathematics, Continuum Mechanics, Stress Analysis, and Mechanical Design. In addition, the book p- vides extensive coverage of great many theoretical problems and numerous references to the literature. The ?eld of Thermal Stresses lies at the crossroads of Stress Analysis, T- ory of Elasticity, Thermodynamics, Heat Conduction Theory, and advanced methods of Applied Mathematics. Each of these areas is covered to the extend it is necessary. Therefore, the book is self-contained, so that the reader should not need to consult other sources while studying the topic. The book starts from basic concepts and principles, and these are developed to more advanced levels as the text progresses. Nevertheless, some basic preparation on the part of the reader in Classical Mechanics, Stress Analysis, and Mathematics, - cluding Vector and Cartesian Tensor Analysis is expected. While selecting material for the book, the authors made every e?ort to present both classical topics and methods, and modern, or more recent, dev- opments in the ?eld. The book comprises ten chapters.
Author: Burkhard Martens
Publisher:
ISBN: 9783000202339
Category :
Languages : en
Pages : 269
Get Book Here
Book Description
Author: Lisa Heschong
Publisher: MIT Press
ISBN: 9780262580397
Category : Architecture
Languages : en
Pages : 100
Get Book Here
Book Description
Our thermal environment is as rich in cultural associations as our visual, acoustic, olfactory, and tactile environments. This book explores the potential for using thermal qualities as an expressive element in building design. Until quite recently, building technology and design has favored high-energy-consuming mechanical methods of neutralizing the thermal environment. It has not responded to the various ways that people use, remember, and care about the thermal environment and how they associate their thermal sense with their other senses. The hearth fire, the sauna, the Roman and Japanese baths, and the Islamic garden are discussed as archetypes of thermal delight about which rituals have developed—reinforcing bonds of affection and ceremony forged in the thermal experience. Not only is thermal symbolism now obsolete but the modern emphasis on central heating systems and air conditioning and hermetically sealed buildings has actually damaged our thermal coping and sensing mechanisms. This book for the solar age could help change all that and open up for us a new dimension of architectural experience. As the cost of energy continues to skyrocket, alternatives to the use of mechanical force must be developed to meet our thermal needs. A major alternative is the use of passive solar energy, and the book will provide those interested in solar design with a reservoir of ideas.
Author: S. Daniel Holdsworth
Publisher: Springer Science & Business Media
ISBN: 0387722505
Category : Technology & Engineering
Languages : en
Pages : 423
Get Book Here
Book Description
This is the second edition of Holdsworth and Simpson’s highly practical work on a subject of growing importance in this age of convenience foods. As before, it discusses the physical and engineering aspects of the thermal processing of packaged foods, and examines the methods which have been used to establish the time and temperature of processes to sterilize or pasteurize the food. However, there is lots of new material too. Unlike other texts on thermal processing, which cover very adequately the technology of the subject, the unique emphasis of this text is on processing engineering and its relation to the safety of processed foods products.
Author: Natan B. Vargaftik
Publisher: CRC Press
ISBN: 9780849393457
Category : Science
Languages : en
Pages : 368
Get Book Here
Book Description
Handbook of Thermal Conductivity of Liquids and Gases covers practically all of the data available on the thermalconductivity of pure liquids and gases. Thermal conductivity data included in the book is based on original experimental measurements and correlations recommended or adopted as a standard by the National Standard Reference Data Service of the Russian Federation. New tabulations of thermal conductivity data on high-molecular organic fluids and the alkali metals in both liquid and gaseous states are featured as well. This book will be an important reference for all researchers working in thermodynamics.
Author: Serge Raseev
Publisher: CRC Press
ISBN: 9780203912300
Category : Science
Languages : en
Pages : 944
Get Book Here
Book Description
This text examines the thermal and catalytic processes involved in the refining of petroleum including visbreaking, coking, pyrolysis, catalytic cracking, oligomerization, alkylation, hydrofining, hydroisomerization, hydrocracking, and catalytic reforming. It analyzes the thermodynamics, reaction mechanisms, and kinetics of each process, as well as
Author: Eric C. Guyer
Publisher: CRC Press
ISBN: 9781560328117
Category : Technology & Engineering
Languages : en
Pages : 710
Get Book Here
Book Description
Gives a foundation to the four principle facets of thermal design: heat transfer analysis, materials performance, heating and cooling technology, and instrumentation and control. The focus is on providing practical thermal design and development guidance across the spectrum of problem analysis, material applications, equipment specification, and sensor and control selection.
Author: Ronald Phillip Tye
Publisher: ASTM International
ISBN:
Category : Heat
Languages : en
Pages : 451
Get Book Here
Book Description
Author: Lian-Tuu Yeh
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 454
Get Book Here
Book Description
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Author: Christopher C. Berndt
Publisher: ASM International
ISBN: 1615032304
Category : Technology & Engineering
Languages : en
Pages : 1338
Get Book Here
Book Description
