Author: Michael Hosking
Publisher: Springer Science & Business Media
ISBN: 1468414402
Category : Technology & Engineering
Languages : en
Pages : 367
Book Description
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
The Mechanics of Solder Alloy Wetting and Spreading
Author: Michael Hosking
Publisher: Springer Science & Business Media
ISBN: 1468414402
Category : Technology & Engineering
Languages : en
Pages : 367
Book Description
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
Publisher: Springer Science & Business Media
ISBN: 1468414402
Category : Technology & Engineering
Languages : en
Pages : 367
Book Description
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.
The Mechanics of Solder Alloy Wetting and Spreading
Author: Michael Hosking
Publisher:
ISBN: 9781468414417
Category :
Languages : en
Pages : 380
Book Description
Publisher:
ISBN: 9781468414417
Category :
Languages : en
Pages : 380
Book Description
Mechanics of Solder Alloy Interconnects
Author: Darrel R. Frear
Publisher: Springer Science & Business Media
ISBN: 9780442015053
Category : Computers
Languages : en
Pages : 434
Book Description
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Publisher: Springer Science & Business Media
ISBN: 9780442015053
Category : Computers
Languages : en
Pages : 434
Book Description
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Author: Mohd Arif Anuar Mohd Salleh
Publisher: Springer Nature
ISBN: 9811992673
Category : Science
Languages : en
Pages : 873
Book Description
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Publisher: Springer Nature
ISBN: 9811992673
Category : Science
Languages : en
Pages : 873
Book Description
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Semiconductor Measurement Technology
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 72
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 72
Book Description
National Semiconductor Metrology Program
Author: National Semiconductor Metrology Program (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 120
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 120
Book Description
National Semiconductor Metrology Program, NIST List OF Publications, LP 103, May 2000
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 160
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 160
Book Description
National Semiconductor Metrology Program
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 160
Book Description
National Semiconductor Metrology Program, Semiconductor Electronics Division, NIST List Of Publications, LP 103, March 1999
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 148
Book Description
Principles of Soldering
Author: Giles Humpston
Publisher: ASM International
ISBN: 1615031707
Category : Technology & Engineering
Languages : en
Pages : 284
Book Description
Publisher: ASM International
ISBN: 1615031707
Category : Technology & Engineering
Languages : en
Pages : 284
Book Description