Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
The Fifth Conference on Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 572
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 572
Book Description
Thermal Conductivity 16
Author: David C. Larsen
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Publisher: Springer Science & Business Media
ISBN: 1468442651
Category : Technology & Engineering
Languages : en
Pages : 606
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Thermal Conductivity
Author: Daniel R. Flynn
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 832
Book Description
NBS Special Publication
Author:
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 832
Book Description
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 832
Book Description
Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 724
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 724
Book Description
Thermal Conductivity 22
Author: Timothy W. Tong
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Thermal Conductivity
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 656
Book Description
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 656
Book Description
Nuclear Science Abstracts
Author:
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 722
Book Description
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 722
Book Description
Thermal Conductivity 17
Author: J. G. Hust
Publisher: Springer
ISBN:
Category : Science
Languages : en
Pages : 824
Book Description
Publisher: Springer
ISBN:
Category : Science
Languages : en
Pages : 824
Book Description
Technical Report - Jet Propulsion Laboratory, California Institute of Technology
Author: Jet Propulsion Laboratory (U.S.)
Publisher:
ISBN:
Category : Jet propulsion
Languages : en
Pages : 24
Book Description
Publisher:
ISBN:
Category : Jet propulsion
Languages : en
Pages : 24
Book Description