The Fabrication and Characterisation of 4H-SiC Schottky Barrier Diodes PDF Download
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Author: Dominique Johanne Morrison
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Dominique Johanne Morrison
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Author: Dominique Johanne Morrison
Publisher:
ISBN:
Category :
Languages : en
Pages : 171
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Author: Jingyan Zhang
Publisher:
ISBN:
Category :
Languages : en
Pages : 330
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Author: Denis Perrone
Publisher: LAP Lambert Academic Publishing
ISBN: 9783838380643
Category :
Languages : en
Pages : 116
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Book Description
Silicon Carbide (SiC) is a semiconductor employed for the fabrication of high - power and high - frequency electronic devices, with lower power losses and smaller size than their Si or GaAs counterparts. Recently, SiC substrates with a very low defect density, and with a good control on the doping characteristics became commercially available. Due to these technological improvements, the polytype 4H can be exploited in all its potential in order to fabricate Schottky Barrier Diodes (SBDs) and Junction Field Effect Transistors (JFETs). SiC SBDs with 600 V blocking voltage capabilities have been yet commercialized. This device can provide theoretical blocking voltage values as high as 3300 V with low leakage currents, well beyond the performances of the Si - based counterpart. In particular, SiC - based transistor JFETs can be designed with a vertical structure using the 4H polytype, because of the high values of the on - axis mobility. This book provides to the researchers in the field of SiC power devices an introduction to the process techniques commonly employed for the fabrication and characterization of SiC SBDs and JFETs.
Author: Tsunenobu Kimoto
Publisher: John Wiley & Sons
ISBN: 1118313550
Category : Technology & Engineering
Languages : en
Pages : 565
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A comprehensive introduction and up-to-date reference to SiC power semiconductor devices covering topics from material properties to applications Based on a number of breakthroughs in SiC material science and fabrication technology in the 1980s and 1990s, the first SiC Schottky barrier diodes (SBDs) were released as commercial products in 2001. The SiC SBD market has grown significantly since that time, and SBDs are now used in a variety of power systems, particularly switch-mode power supplies and motor controls. SiC power MOSFETs entered commercial production in 2011, providing rugged, high-efficiency switches for high-frequency power systems. In this wide-ranging book, the authors draw on their considerable experience to present both an introduction to SiC materials, devices, and applications and an in-depth reference for scientists and engineers working in this fast-moving field. Fundamentals of Silicon Carbide Technology covers basic properties of SiC materials, processing technology, theory and analysis of practical devices, and an overview of the most important systems applications. Specifically included are: A complete discussion of SiC material properties, bulk crystal growth, epitaxial growth, device fabrication technology, and characterization techniques. Device physics and operating equations for Schottky diodes, pin diodes, JBS/MPS diodes, JFETs, MOSFETs, BJTs, IGBTs, and thyristors. A survey of power electronics applications, including switch-mode power supplies, motor drives, power converters for electric vehicles, and converters for renewable energy sources. Coverage of special applications, including microwave devices, high-temperature electronics, and rugged sensors. Fully illustrated throughout, the text is written by recognized experts with over 45 years of combined experience in SiC research and development. This book is intended for graduate students and researchers in crystal growth, material science, and semiconductor device technology. The book is also useful for design engineers, application engineers, and product managers in areas such as power supplies, converter and inverter design, electric vehicle technology, high-temperature electronics, sensors, and smart grid technology.
Author: Luo, Xixi
Publisher:
ISBN:
Category :
Languages : en
Pages : 116
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Book Description
A novel design of mesa-etch termination and Superjunction JBS diode structure has been proposed and optimized. The new mesa-etch termination can achieve over 90% of ideal maximal breakdown voltage within a wide sidewall implant dose window (~9e16 cm−3). Besides the high tolerance on implant dose, the proposed design also exhibits high tolerance on the etch sidewall angle: minimal maximum breakdown voltage was observed with etch sidewall angle variations. The Superjunction JBS diode can obtain both 96.4% maximum super junction breakdown voltage and 76.6% JBS Schottky surface electric field reduction. The super junction maximal breakdown voltage is 1.5 times large as the conventional Schottky diode breakdown voltage and the leakage current is logarithmically related to the surface electric field. The superior breakdown voltage represents a large improvement on the power rectifier performance. Based on these structure improvements, vertical 4H-SiC Schottky Diodes have been fabricated and tested. Vertical 4H-SiC Schottky Diode without any edge termination has a breakdown voltage as large as 692 V and exhibits an on-state specific resistance as small as 7.9 mΩ*cm2. Such breakdown voltage is much higher than simulation results. In the meantime, on-state resistance is also much larger than the simulation results. The mechanism for these improved power rectifier performances will be furthered investigated in future studies
Author: James A. Griffin
Publisher:
ISBN:
Category :
Languages : en
Pages : 68
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Author: Shandirai Malven Tunhuma
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Silicon carbide has become an important material in the implementation of next generation photonics. It harbors the silicon vacancy (VSi) which can be transformed to a carbon antisite-vacancy pair (CSiVC) defect through thermal treatment. This defect has quantum functionality and can be used as a single photon source at room temperature. Using defect engineering, this technology is set to surpass advances made in other similar systems because it is being developed on existing standard industrial practices, fabrication protocols and mechanisms. These include techniques such as irradiation, annealing and ion implantation. The motivation of this work was to establish sound device fabrication protocols to be used in the device implementation. In this thesis DLTS and Laplace DLTS have been used to characterize deep level defects induced by various processes in 4H-SiC. Schottky barrier diodes were used to create the space charge region required to probe the defect characteristics using capacitance DLTS. From the DLTS and Laplace DLTS the activation energies of the defects were accurately deduced and the apparent capture cross section was calculated. The defect concentration was also quanti ed in the form of depth pro les plotted from the metal-semiconductor interface of the Schottky barrier diodes into the bandgap of the semiconductor. SEM, AFM and XRD were used to probe the changes in surface morphology and composition accompanying the processing steps whilst Raman spectroscopy was used to probe the nature of induced defects. Sputter deposition of tungsten on 4H-SiC was successfully used to induce the E0:69 which is the VSi. The identity of VSi was con rmed by thermal treatment and it annealed beyond detection at 600 C as expected. A previously unreported defect, the E0:29 was also observed after sputtering and was attributed to the heavy metal and gas ion residue from the deposition process. In order to transform the VSi into CSiVC, W/4H-SiC diodes were annealed up to 1100 C. This resulted in the formation of defects which were attributed to the interdi usion of silicides and carbides formed at the W/4H-SiC interface, as detected by XRD, migrating into the SiC. This was an unfavourable outcome for photonics applications where purity of the semiconductor is a major concern. As an alternative solution, the VSi was induced in 4H-SiC using 167 MeV, Xe26+ swift heavy ions. Xe is a noble gas therefore it would not react with the semiconductor. The structure and integrity of the lattice structure was conserved after irradiation as deduced from confocal Raman microscopy. The depth and concentration of the defects as observed in confocal Raman was consistent with SRIM simulations. AFM showed that the radiation introduced elongated protrusions on the surface of the semiconductor. The observations show that the silicon vacancy can be induced in 4H-SiC by standard industrial practices such as sputter deposition or ion irradiation.
Author: Yifan Jiang
Publisher:
ISBN:
Category :
Languages : en
Pages : 121
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Author: Konstantinos Zekentes
Publisher: Materials Research Forum LLC
ISBN: 1945291850
Category : Technology & Engineering
Languages : en
Pages : 249
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Book Description
The rapidly advancing Silicon Carbide technology has a great potential in high temperature and high frequency electronics. High thermal stability and outstanding chemical inertness make SiC an excellent material for high-power, low-loss semiconductor devices. The present volume presents the state of the art of SiC device fabrication and characterization. Topics covered include: SiC surface cleaning and etching techniques; electrical characterization methods and processing of ohmic contacts to silicon carbide; analysis of contact resistivity dependence on material properties; limitations and accuracy of contact resistivity measurements; ohmic contact fabrication and test structure design; overview of different metallization schemes and processing technologies; thermal stability of ohmic contacts to SiC, their protection and compatibility with device processing; Schottky contacts to SiC; Schottky barrier formation; Schottky barrier inhomogeneity in SiC materials; technology and design of 4H-SiC Schottky and Junction Barrier Schottky diodes; Si/SiC heterojunction diodes; applications of SiC Schottky diodes in power electronics and temperature/light sensors; high power SiC unipolar and bipolar switching devices; different types of SiC devices including material and technology constraints on device performance; applications in the area of metal contacts to silicon carbide; status and prospects of SiC power devices.
