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Author: Wade H. Shafer
Publisher: Springer Science & Business Media
ISBN: 1461303931
Category : Science
Languages : en
Pages : 427
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Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 39 (thesis year 1994) a total of 13,953 thesis titles from 21 Canadian and 159 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 39 reports theses submitted in 1994, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
Author: Wade H. Shafer
Publisher: Springer Science & Business Media
ISBN: 1461303931
Category : Science
Languages : en
Pages : 427
Get Book Here
Book Description
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS)* at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dis semination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all concerned if the printing and distribution of the volumes were handled by an international publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Corporation of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 39 (thesis year 1994) a total of 13,953 thesis titles from 21 Canadian and 159 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this impor tant annual reference work. While Volume 39 reports theses submitted in 1994, on occasion, certain uni versities do report theses submitted in previous years but not reported at the time.
Author: Sung-Mo Kang
Publisher:
ISBN: 9780071243421
Category : Digital integrated circuits
Languages : en
Pages : 655
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Book Description
The fourth edition of CMOS Digital Integrated Circuits: Analysis and Design continues the well-established tradition of the earlier editions by offering the most comprehensive coverage of digital CMOS circuit design, as well as addressing state-of-the-art technology issues highlighted by the widespread use of nanometer-scale CMOS technologies. In this latest edition, virtually all chapters have been re-written, the transistor model equations and device parameters have been revised to reflect the sigificant changes that must be taken into account for new technology generations, and the material has been reinforced with up-to-date examples. The broad-ranging coverage of this textbook starts with the fundamentals of CMOS process technology, and continues with MOS transistor models, basic CMOS gates, interconnect effects, dynamic circuits, memory circuits, arithmetic building blocks, clock and I/O circuits, low power design techniques, design for manufacturability and design for testability.
Author: Jan M. Rabaey
Publisher:
ISBN: 9780133942712
Category : Digital integrated circuits
Languages : en
Pages : 702
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Book Description
Beginning with discussions on the operation of electronic devices and analysis of the nucleus of digital design, the text addresses: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the effect of design automation on the digital design perspective.
Author: Ban Wong
Publisher: John Wiley & Sons
ISBN: 0471678864
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.
Author: Debaprasad Das
Publisher:
ISBN: 9780198094869
Category : Electronic circuit design
Languages : en
Pages : 0
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Book Description
Beginning with an introduction to VLSI systems and basic concepts of MOS transistors, this second edition of the book then proceeds to describe the various concepts of VLSI, such as the structure and operation of MOS transistors and inverters, standard cell library design and itscharacterization, analog and digital CMOS logic design, semiconductor memories, and BiCMOS technology and circuits. It then provides an exhaustive step-wise discussion of the various stages involved in designing a VLSI chip (which includes logic synthesis, timing analysis, floor planning, placementand routing, verification, and testing). In addition, the book includes chapters on FPGA architecture, VLSI process technology, subsystem design, and low power logic circuits.
Author: Nikhil Jayakumar
Publisher: Springer Science & Business Media
ISBN: 1441909508
Category : Technology & Engineering
Languages : en
Pages : 229
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Book Description
Power consumption of VLSI (Very Large Scale Integrated) circuits has been growing at an alarmingly rapid rate. This increase in power consumption, coupled with the increasing demand for portable/hand-held electronics, has made power consumption a dominant concern in the design of VLSI circuits today. Traditionally, dynamic (switching) power has dominated the total power consumption of an IC. However, due to current scaling trends, leakage power has now become a major component of the total power consumption in VLSI circuits. Leakage power reduction is especially important in portable/hand-held electronics such as cell-phones and PDAs. This book presents two techniques aimed at reducing leakage power in digital VLSI ICs. The first technique reduces leakage through the selective use of high threshold voltage sleep transistors. The second technique reduces leakage by applying the optimal Reverse Body Bias (RBB) voltage. This book also shows readers how to turn the leakage problem into an opportunity, through the use of sub-threshold logic.
Author: Liming Xiu
Publisher: John Wiley & Sons
ISBN: 0470199105
Category : Technology & Engineering
Languages : en
Pages : 222
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Book Description
This book was written to arm engineers qualified and knowledgeable in the area of VLSI circuits with the essential knowledge they need to get into this exciting field and to help those already in it achieve a higher level of proficiency. Few people truly understand how a large chip is developed, but an understanding of the whole process is necessary to appreciate the importance of each part of it and to understand the process from concept to silicon. It will teach readers how to become better engineers through a practical approach of diagnosing and attacking real-world problems.
Author: Sorin Cristoloveanu
Publisher: Springer Science & Business Media
ISBN: 9780792395485
Category : Technology & Engineering
Languages : en
Pages : 414
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Book Description
Silicon on Insulator is more than a technology, more than a job, and more than a venture in microelectronics; it is something different and refreshing in device physics. This book recalls the activity and enthu siasm of our SOl groups. Many contributing students have since then disappeared from the SOl horizon. Some of them believed that SOl was the great love of their scientific lives; others just considered SOl as a fantastic LEGO game for adults. We thank them all for kindly letting us imagine that we were guiding them. This book was very necessary to many people. SOl engineers will certainly be happy: indeed, if the performance of their SOl components is not always outstanding, they can now safely incriminate the relations given in the book rather than their process. Martine, Gunter, and Y. S. Chang can contemplate at last the amount of work they did with the figures. Our SOl accomplices already know how much we borrowed from their expertise and would find it indecent to have their detailed contri butions listed. Jean-Pierre and Dimitris incited the book, while sharing their experience in the reliability of floating bodies. Our families and friends now realize the SOl capability of dielectrically isolating us for about two years in a BOX. Our kids encouraged us to start writing. Our wives definitely gave us the courage to stop writing. They had a hard time fighting the symptoms of a rapidly developing SOl allergy.
Author: Angel Abusleme
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 155
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Book Description
The International Linear Collider (ILC), a next generation particle accelerator, will smash electron and positron bunches at up to 500 GeV (1000 GeV after a planned upgrade). The 31-km long collider's experiments will help scientists to understand the fundamental constituents of matter. Located at the ILC detector's forward region, the BeamCal is a highly segmented (> 90,000 channels) calorimeter that will serve three main purposes: ensure hermeticity of the detector for low polar angles, reduce the backscattering from pairs into the detector center, and provide a low-latency signal for beam diagnostics. The BeamCal specifications in terms of radiation tolerance, noise suppression, signal charge, pulse rate and occupancy pose unique challenges for the front-end and readout electronics design. Designed for the 180-nm TSMC mixed-signal technology, The Bean -- BeamCal Instrumentation IC -- is a 32-channel front-end and readout ASIC that will address the BeamCal instrumentation requirements. By employing a charge-sensitive amplifier and a switched-capacitor reset circuit, the Bean will process the input charge signals at the ILC pulse rate. Each channel will have a 10-bit successive approximation register analog-to-digital converter and digital memory for readout purposes. The Bean will also feature a fast feedback adder, capable of providing an 8-bit, low-latency output for beam diagnostics purposes. This work presents the design and characterization of The Bean prototype, a 3-channel ASIC that proves the principle of operation described.
Author: David A. Hodges
Publisher: McGraw-Hill Incorporated
ISBN: 9780071181648
Category : Digital integrated circuits
Languages : en
Pages : 580
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Book Description
The third edition of Hodges and Jackson’s Analysis and Design of Digital Integrated Circuits has been thoroughly revised and updated by a new co-author, Resve Saleh of the University of British Columbia. The new edition combines the approachability and concise nature of the Hodges and Jackson classic with a complete overhaul to bring the book into the 21st century. The new edition has replaced the emphasis on BiPolar with an emphasis on CMOS. The outdated MOS transistor model used throughout the book will be replaced with the now standard deep submicron model. The material on memory has been expanded and updated. As well the book now includes more on SPICE simulation and new problems that reflect recent technologies. The emphasis of the book is on design, but it does not neglect analysis and has as a goal to provide enough information so that a student can carry out analysis as well as be able to design a circuit. This book provides an excellent and balanced introduction to digital circuit design for both students and professionals.
