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Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Suny Li (Li Yang)
Publisher: John Wiley & Sons
ISBN: 1119045932
Category : Technology & Engineering
Languages : en
Pages : 508
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Book Description
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Author: Lei He
Publisher: Now Publishers Inc
ISBN: 1601984588
Category : Computers
Languages : en
Pages : 93
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Book Description
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793777
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Michael P. Gaynor
Publisher: Artech House Publishers
ISBN: 9781580539050
Category : Engineering
Languages : en
Pages : 0
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Book Description
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
Author: Hadley Wickham
Publisher: "O'Reilly Media, Inc."
ISBN: 1491910542
Category : Computers
Languages : en
Pages : 201
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Book Description
Turn your R code into packages that others can easily download and use. This practical book shows you how to bundle reusable R functions, sample data, and documentation together by applying author Hadley Wickham’s package development philosophy. In the process, you’ll work with devtools, roxygen, and testthat, a set of R packages that automate common development tasks. Devtools encapsulates best practices that Hadley has learned from years of working with this programming language. Ideal for developers, data scientists, and programmers with various backgrounds, this book starts you with the basics and shows you how to improve your package writing over time. You’ll learn to focus on what you want your package to do, rather than think about package structure. Learn about the most useful components of an R package, including vignettes and unit tests Automate anything you can, taking advantage of the years of development experience embodied in devtools Get tips on good style, such as organizing functions into files Streamline your development process with devtools Learn the best way to submit your package to the Comprehensive R Archive Network (CRAN) Learn from a well-respected member of the R community who created 30 R packages, including ggplot2, dplyr, and tidyr
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Hadley Wickham
Publisher: CRC Press
ISBN: 1498759807
Category : Mathematics
Languages : en
Pages : 669
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Book Description
An Essential Reference for Intermediate and Advanced R Programmers Advanced R presents useful tools and techniques for attacking many types of R programming problems, helping you avoid mistakes and dead ends. With more than ten years of experience programming in R, the author illustrates the elegance, beauty, and flexibility at the heart of R. The book develops the necessary skills to produce quality code that can be used in a variety of circumstances. You will learn: The fundamentals of R, including standard data types and functions Functional programming as a useful framework for solving wide classes of problems The positives and negatives of metaprogramming How to write fast, memory-efficient code This book not only helps current R users become R programmers but also shows existing programmers what’s special about R. Intermediate R programmers can dive deeper into R and learn new strategies for solving diverse problems while programmers from other languages can learn the details of R and understand why R works the way it does.
Author:
Publisher:
ISBN:
Category : Business
Languages : en
Pages : 464
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Book Description
Author: Joseph P Iannotti
Publisher: Elsevier Health Sciences
ISBN: 141606379X
Category : Medical
Languages : en
Pages : 357
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Book Description
Basic Science and Systemic Disease, Part 3 of The Netter Collection of Medical Illustrations: Musculoskeletal System, 2nd Edition, provides a highly visual guide to this body system, from foundational basic science and anatomy to orthopaedics and rheumatology. This spectacularly illustrated volume in the masterwork known as the (CIBA) "Green Books" has been expanded and revised by Dr. Joseph Iannotti, Dr. Richard Parker, and other experts from the Cleveland Clinic to mirror the many exciting advances in musculoskeletal medicine and imaging - offering rich insights into embryology; physiology; metabolic disorders; congenital and development disorders; rheumatic diseases; tumors of musculoskeletal system; injury to musculoskeletal system; soft tissue infections; and fracture complications. Get complete, integrated visual guidance on the musculoskeletal system with thorough, richly illustrated coverage. Quickly understand complex topics thanks to a concise text-atlas format that provides a context bridge between primary and specialized medicine. Clearly visualize how core concepts of anatomy, physiology, and other basic sciences correlate across disciplines. Benefit from matchless Netter illustrations that offer precision, clarity, detail and realism as they provide a visual approach to the clinical presentation and care of the patient. Gain a rich clinical view of embryology; physiology; metabolic disorders; congenital and development disorders; rheumatic diseases; tumors of musculoskeletal system; injury to musculoskeletal system; soft tissue infections; and fracture complications in one comprehensive volume, conveyed through beautiful illustrations as well as up-to-date radiologic and laparoscopic images. Benefit from the expertise of Drs. Joseph Iannotti, Richard Parker, and esteemed colleagues from the Cleveland Clinic, who clarify and expand on the illustrated concepts. Clearly see the connection between basic science and clinical practice with an integrated overview of normal structure and function as it relates to pathologic conditions. See current clinical concepts in orthopaedics and rheumatology captured in classic Netter illustrations, as well as new illustrations created specifically for this volume by artist-physician Carlos Machado, MD, and others working in the Netter style.
