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Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: C. P.(Ching-Ping) Wong
Publisher: Springer Nature
ISBN: 303049991X
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author: Xingcun Colin Tong
Publisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
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Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Wei Pan
Publisher: Trans Tech Publications Ltd
ISBN: 3038131938
Category : Technology & Engineering
Languages : en
Pages : 1988
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Book Description
Selected, peer reviewed papers the Fifth China International Conference on High-Performance Ceramics (CICC-5), Changsha, China, May 10 ~ 13, 2007
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1360
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Book Description
Author: ASM International. Handbook Committee
Publisher: ASM International
ISBN: 0871702835
Category : Technology & Engineering
Languages : en
Pages : 1313
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Book Description
A comprehensive reference on the properties, selection, processing, and applications of the most widely used nonmetallic engineering materials. Section 1, General Information and Data, contains information applicable both to polymers and to ceramics and glasses. It includes an illustrated glossary, a collection of engineering tables and data, and a guide to materials selection. Sections 2 through 7 focus on polymeric materials--plastics, elastomers, polymer-matrix composites, adhesives, and sealants--with the information largely updated and expanded from the first three volumes of the Engineered Materials Handbook. Ceramics and glasses are covered in Sections 8 through 12, also with updated and expanded information. Annotation copyright by Book News, Inc., Portland, OR
Author: National Research Council
Publisher: National Academies Press
ISBN: 030904233X
Category : Technology & Engineering
Languages : en
Pages : 154
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Book Description
Author: Jean-Fu Kiang
Publisher: Springer Science & Business Media
ISBN: 1475741561
Category : Technology & Engineering
Languages : en
Pages : 617
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Book Description
Novel Technologies for Microwave and Millimeter-Wave Applications provides an overview of current research status in selected field, to facilitate a learning process from concepts to practices, from component design to system architecture, and from small scale to large scale. Each chapter focuses on a topic and is organized to be self-sufficient. Contents in each chapter include concise description of relevant background information, major issues, current trend and future challenges. Useful references are also listed for further reading. Novel Technologies for Microwave and Millimeter-Wave Applications is suitable as a textbook for senior or graduate courses in microwave engineering.
Author: Dolores Eliche Quesada
Publisher: BoD – Books on Demand
ISBN: 1789857732
Category : Technology & Engineering
Languages : en
Pages : 108
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Book Description
Scientific and technological development has led to the formulation of tailor-made materials, which have given rise to materials with new structural and industrial applications. This book aims to analyze the synthesis, characterization, and applications of ceramic materials. This includes an introduction to traditional and advanced ceramics, the use of traditional ceramic materials as ideal candidates for absorbing wastes, and the synthesis and characterization of advanced ceramics as nanoceramics, ytria ceramics, and electronic ceramics.
Author:
Publisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 950
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Book Description
