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Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Get Book Here
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: Hong Liang
Publisher: CRC Press
ISBN: 1420028391
Category : Technology & Engineering
Languages : en
Pages : 199
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Book Description
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 9783540431817
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 732
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Book Description
Author: Jamal Takadoum
Publisher: John Wiley & Sons
ISBN: 1118623061
Category : Technology & Engineering
Languages : en
Pages : 179
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Book Description
This title is designed to provide a clear and comprehensive overview of tribology. The book introduces the notion of a surface in tribology where a solid surface is described from topographical, structural, mechanical, and energetic perspectives. It also describes the principal techniques used to characterize and analyze surfaces. The title then discusses what may be called the fundamentals of tribology by introducing and describing the concepts of adhesion, friction, wear, and lubrication. The book focuses on the materials used in tribology, introducing the major classes of materials used, either in their bulk states or as coatings, including both protective layers and other coatings used for decorative purposes. Of especial importance to the tribology community are sections that provide the latest information on Nanotribology, Wear, Lubrication, and Wear-Corrosion: Tribocorrosion and Erosion-Corrosion.
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
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Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Author: Frank Vollertsen
Publisher: Springer Nature
ISBN: 3030112802
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
This open access book contains the research report of the Collaborative Research Center “Micro Cold Forming” (SFB 747) of the University of Bremen, Germany. The topical research focus lies on new methods and processes for a mastered mass production of micro parts which are smaller than 1mm (by forming in batch size higher than one million). The target audience primarily comprises research experts and practitioners in production engineering, but the book may also be of interest to graduate students alike.
Author: Yuzhuo Li
Publisher: John Wiley & Sons
ISBN: 0471719196
Category : Technology & Engineering
Languages : en
Pages : 764
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Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Author:
Publisher:
ISBN: 9780070451612
Category : Technology & Engineering
Languages : en
Pages : 52
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Book Description
Author: Jean Michel Martin
Publisher: John Wiley & Sons
ISBN: 0470987707
Category : Science
Languages : en
Pages : 246
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Book Description
The technology involved in lubrication by nanoparticles is a rapidly developing scientific area and one that has been watched with interest for the past ten years. Nanolubrication offers a solution to many problems associated with traditional lubricants that contain sulphur and phosphorus; and though for some time the production of nanoparticles was restricted by the technologies available, today synthesis methods have been improved to such a level that it is possible to produce large quantities relatively cheaply and efficiently. Nanolubricants develops a new concept of lubrication, based on these nanoparticles, and along with the authors’ own research it synthesises the information available on the topic of nanolubrication from existing literature and presents it in a concise form. Describes the many advantages and potential applications of nanotechnology in the tribological field. Offers a full review of the state-of-the-art as well as much original research that is yet unpublished. Includes sections on boundary lubrication by colloïdal systems, nanolubricants made of metal dichalcogenides, carbon-based nanolubricants, overbased detergent salts, nanolubricants made of metals and boron-based solid nanolubricants and lubrication additives. Authored by highly regarded experts in the field with contributions from leading international academics. Nanolubricants will appeal to postgraduate students, academics and researchers in mechanical engineering, chemical engineering and materials science. It should also be of interest to practising engineers with petroleum companies and mechanical manufacturers.
