Author: Yeeli Lee
Publisher:
ISBN:
Category :
Languages : en
Pages : 96
Book Description
Study of Selective CVD Tungsten as a Diffusion Barrier for Electroless Copper Depositions
Author: Yeeli Lee
Publisher:
ISBN:
Category :
Languages : en
Pages : 96
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 96
Book Description
Tungsten and Other Refractory Metals for VLSI Applications II: Volume 2
Author: Eliot K. Broadbent
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 450
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 450
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Modeling of Chemical Vapor Deposition of Tungsten Films
Author: Chris R. Kleijn
Publisher: Birkhäuser
ISBN: 3034877412
Category : Science
Languages : en
Pages : 138
Book Description
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and optimization of manufacturing equipment and hence reduce the cost and improve the quality of the reactors. This book is the result of two parallel lines of research dealing with the same subject - Modeling of Tungsten CVD processes -, which were per formed independently under very different boundary conditions. On the one side, Chris Kleijn, working in an academic research environment, was able to go deep enough into the subject to laya solid foundation and prove the validity of all the assumptions made in his work. On the other side, Christoph Werner, working in the context of an industrial research lab, was able to closely interact with manufacturing and development engineers in a modern submicron semiconductor processing line. Because of these different approaches, the informal collaboration during the course of the projects proved to be extremely helpful to both sides, even though - or perhaps because - different computer codes, different CVD reactors and also slightly different models were used. In spite of the inconsistencies which might arise from this double approach, we feel that the presentation of both sets of results in one book will be very useful for people working in similar projects.
Publisher: Birkhäuser
ISBN: 3034877412
Category : Science
Languages : en
Pages : 138
Book Description
Semiconductor equipment modeling has in recent years become a field of great interest, because it offers the potential to support development and optimization of manufacturing equipment and hence reduce the cost and improve the quality of the reactors. This book is the result of two parallel lines of research dealing with the same subject - Modeling of Tungsten CVD processes -, which were per formed independently under very different boundary conditions. On the one side, Chris Kleijn, working in an academic research environment, was able to go deep enough into the subject to laya solid foundation and prove the validity of all the assumptions made in his work. On the other side, Christoph Werner, working in the context of an industrial research lab, was able to closely interact with manufacturing and development engineers in a modern submicron semiconductor processing line. Because of these different approaches, the informal collaboration during the course of the projects proved to be extremely helpful to both sides, even though - or perhaps because - different computer codes, different CVD reactors and also slightly different models were used. In spite of the inconsistencies which might arise from this double approach, we feel that the presentation of both sets of results in one book will be very useful for people working in similar projects.
Pulsed Chemical Vapor Deposition of Tungsten Carbide for Diffusion Barriers in Copper Metalization Schemes
Author: Timo Sammet
Publisher:
ISBN:
Category : Copper
Languages : en
Pages : 192
Book Description
Publisher:
ISBN:
Category : Copper
Languages : en
Pages : 192
Book Description
Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ ULSI Applications
Author: John E.J. Schmitz
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 264
Book Description
Publisher description.
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 264
Book Description
Publisher description.
Tungsten and Other Refractory Metals for VLSI Applications III
Author: Victor A. Wells
Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
"Seedless" Electrochemical Deposition of Copper on Air-exposed Tantalum Nitride and Tungsten Nitride Diffusion Barrier Materials
Author: Michael J. Shaw
Publisher:
ISBN:
Category :
Languages : en
Pages : 106
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 106
Book Description
Tungsten and Other Refractory Metals for VLSI Applications
Author:
Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
Publisher:
ISBN:
Category : Heat resistant alloys
Languages : en
Pages : 456
Book Description
Metals Abstracts
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1042
Book Description
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1042
Book Description
Metals Abstracts Index
Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1622
Book Description
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1622
Book Description