Structural Integrity and Reliability in Electronics PDF Download
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Author: W.J. Plumbridge
Publisher: Springer Science & Business Media
ISBN: 1402026110
Category : Technology & Engineering
Languages : en
Pages : 341
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Book Description
Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Author: W.J. Plumbridge
Publisher: Springer Science & Business Media
ISBN: 1402026110
Category : Technology & Engineering
Languages : en
Pages : 341
Get Book Here
Book Description
Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Author: KV Subramanian
Publisher: Springer Science & Business Media
ISBN: 0387484337
Category : Technology & Engineering
Languages : en
Pages : 370
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Book Description
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author: S. G. Pantelakis
Publisher: Springer Science & Business Media
ISBN: 1402094027
Category : Technology & Engineering
Languages : en
Pages : 554
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Book Description
Within the last thirty years there is a growing acknowledgement that prevention of catastrophic failures necessitates engagement of a large pool of expertise. Herein it is not excessive to seek advice from disciplines like materials science, structural engineering, mathematics, physics, reliability engineering and even economics. Today’s engineering goals, independently of size; do not have the luxury of being outsideaglobalperspective.Survivaloftheintegratedmarketsand?nancialsystems require a web of safe transportation, energy production and product manufacturing. It is perhaps the ?rst decade in engineering history that multidisciplinary - proaching is not just an idea that needs to materialise but has matured beyond infancy. We can witness such transition by examining engineering job descriptions and postgraduate curricula. The undertaking of organising a conference to re?ect the above was not easy and de?nitely, not something that was brought to life without a lot of work and c- st mitment. The 1 Conference of Engineering Against Fracture from its conceptual day until completion was designed in a way of underlying the need of bringing all the key players on a common ground that once properly cultivated can ?ourish. To achieve that the conference themes were numerous and despite their, in principle notional differences, it was apparent that the attendees established such common ground through argumentation. The reader can see this from the variety of research areas re?ected by the works and keynote lecturers presented.
Author: Mohd Arif Anuar Mohd Salleh
Publisher: Springer Nature
ISBN: 9811992673
Category : Science
Languages : en
Pages : 873
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Book Description
This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Author: Abdel Salam Hamdy Makhlouf
Publisher: Butterworth-Heinemann
ISBN: 0128113960
Category : Technology & Engineering
Languages : en
Pages : 388
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Book Description
Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Author: Zhenhan Yao
Publisher: Springer Science & Business Media
ISBN: 3540482601
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.
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Category : Aeronautics
Languages : en
Pages : 704
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Book Description
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Category : Hybrid integrated circuits
Languages : en
Pages : 816
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Book Description
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Category : Electronic ceramics
Languages : en
Pages : 812
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Book Description
Author: Panel on Reliability Growth Methods for Defense Systems
Publisher: National Academy Press
ISBN: 9780309314749
Category : Technology & Engineering
Languages : en
Pages : 235
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Book Description
A high percentage of defense systems fail to meet their reliability requirements. This is a serious problem for the U.S. Department of Defense (DOD), as well as the nation. Those systems are not only less likely to successfully carry out their intended missions, but they also could endanger the lives of the operators. Furthermore, reliability failures discovered after deployment can result in costly and strategic delays and the need for expensive redesign, which often limits the tactical situations in which the system can be used. Finally, systems that fail to meet their reliability requirements are much more likely to need additional scheduled and unscheduled maintenance and to need more spare parts and possibly replacement systems, all of which can substantially increase the life-cycle costs of a system. Beginning in 2008, DOD undertook a concerted effort to raise the priority of reliability through greater use of design for reliability techniques, reliability growth testing, and formal reliability growth modeling, by both the contractors and DOD units. To this end, handbooks, guidances, and formal memoranda were revised or newly issued to reduce the frequency of reliability deficiencies for defense systems in operational testing and the effects of those deficiencies. "Reliability Growth" evaluates these recent changes and, more generally, assesses how current DOD principles and practices could be modified to increase the likelihood that defense systems will satisfy their reliability requirements. This report examines changes to the reliability requirements for proposed systems; defines modern design and testing for reliability; discusses the contractor's role in reliability testing; and summarizes the current state of formal reliability growth modeling. The recommendations of "Reliability Growth" will improve the reliability of defense systems and protect the health of the valuable personnel who operate them.
