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Author: Society for Experimental Stress Analysis. Technical Committee on Strain Gages
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 52
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Book Description
Author: Society for Experimental Stress Analysis. Technical Committee on Strain Gages
Publisher:
ISBN:
Category : Materials
Languages : en
Pages : 52
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Book Description
Author: Markus G. R. Sause
Publisher: Springer Nature
ISBN: 3030721922
Category : Aerospace engineering
Languages : en
Pages : 292
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Book Description
This open access book presents established methods of structural health monitoring (SHM) and discusses their technological merit in the current aerospace environment. While the aerospace industry aims for weight reduction to improve fuel efficiency, reduce environmental impact, and to decrease maintenance time and operating costs, aircraft structures are often designed and built heavier than required in order to accommodate unpredictable failure. A way to overcome this approach is the use of SHM systems to detect the presence of defects. This book covers all major contemporary aerospace-relevant SHM methods, from the basics of each method to the various defect types that SHM is required to detect to discussion of signal processing developments alongside considerations of aerospace safety requirements. It will be of interest to professionals in industry and academic researchers alike, as well as engineering students. This article/publication is based upon work from COST Action CA18203 (ODIN - http://odin-cost.com/), supported by COST (European Cooperation in Science and Technology). COST (European Cooperation in Science and Technology) is a funding agency for research and innovation networks. Our Actions help connect research initiatives across Europe and enable scientists to grow their ideas by sharing them with their peers. This boosts their research, career and innovation.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 458
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Book Description
Author: Muthu Wijesundara
Publisher: Springer Science & Business Media
ISBN: 1441971211
Category : Technology & Engineering
Languages : en
Pages : 247
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Book Description
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.
Author: Amanda Schrand
Publisher: CRC Press
ISBN: 1003857183
Category : Technology & Engineering
Languages : en
Pages : 187
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Book Description
The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.
Author: Society for Experimental Stress Analysis. Technical Committee on Strain Gages
Publisher:
ISBN:
Category : Materials at high temperatures
Languages : en
Pages : 58
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Book Description
Author: Society for Experimental Stress Analysis. Technical Committee on Strain Gages
Publisher:
ISBN:
Category : Strain gages
Languages : en
Pages : 31
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Book Description
Author: C. J. Chesmond
Publisher: Elsevier
ISBN: 1483183297
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
Control System Technology focuses on the processes, methodologies, and techniques employed in control system technology, including digital computers, transducers, actuators, and amplifiers. The book first takes a look at classification, terminology, and definitions, displacement, reference, and velocity of transducers, and strain, force, torque, acceleration, load, and tension of transducers. Discussions focus on strain gauges and measuring bridges, other transducers for measuring force, torque, acceleration, and tension, displacement and velocity transducers, natural control systems, classification of control systems, and generalized single loop continuous feedback control system. The monograph examines electric amplifiers and final control elements, hydraulic and pneumatic amplifiers and final control elements, flow control valves, actuators and positioners, and signal and data conversion. The publication also ponders on interfacing control systems to digital computers, control system performance and commissioning, and experimental testing of plant, system elements, and systems. The manuscript is a valuable reference for engineers and researchers interested in control system technology.
Author: K.D. Timmerhaus
Publisher: Springer Science & Business Media
ISBN: 147570531X
Category : Science
Languages : en
Pages : 591
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Book Description
The 1961 Cryogenic Engineering Conference Committee is pleased to present the papers of the 1961 Cryogenic Engineering Conference. We are grateful to have had the University of Michigan at Ann Arbor, Michigan as our host for the seventh annual meeting of this group. The Conference Committee in presenting the papers oftbis Conference takes this opportunity to acknowledge the assistance of an Editorial Committee in the selection of papers for the program. Since over one hundred and twenty papers were submitted, their task of screening and evaluating the papers was a dif ficult one. The Committee guided by G. j. V an Wylen, who also served as chair man of the Conference Committee, included R. W. Arnett, B. W. Birmingham, D. B. Chelton, R. j. Corruccini, C. j. Guntner, M. j. Hiza, R. B. jacobs, A. J. Kidnay, R. H. Kropschot, j. Macinko, D. B. Mann, R. P. Mikesell, R. L. Powell, J. R. Purcell, R. P. Reed, R. j. Richards, A. F. Schmidt, R. B. Stewart, and K. A. Warren.
Author: Babak Jamshidi
Publisher:
ISBN:
Category :
Languages : en
Pages : 322
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Book Description
