Soldering Handbook For Printed Circuits and Surface Mounting PDF Download
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Author: Howard H. Manko
Publisher: Springer Science & Business Media
ISBN: 9780442012069
Category : Computers
Languages : en
Pages : 548
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Book Description
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Author: Howard H. Manko
Publisher: Springer Science & Business Media
ISBN: 9780442012069
Category : Computers
Languages : en
Pages : 548
Get Book
Book Description
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Author: Howard H. Manko
Publisher: Springer
ISBN:
Category : Juvenile Nonfiction
Languages : en
Pages : 456
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Book Description
The printed circuit industry has achieved maturity and universal accep tance. No known interconnection technology threatens to render it obso lete in the foreseeable future. It offers two unique advantages that are important for any assembly technology: quality (reliability) and economy. The mode of component attachment to printed circuit boards, however, is undergoing a radical change. Technical and economic pressures are forcing the industry to convert some or all of its assembly to surface mounting techniques. We are moving away from the traditional large through-the-hole connection with its mechanical security. It is being re placed by a small surface butt and/or lap joint, sometimes with no added mechanical support to the solder. This change requires a complete reas sessment of design, production, and inspection techniques. A major por tion of this book is devoted to the changes imposed by surface mounting. This recent development is an extension of the established hybrid (thick and thin-film) industry. Yet when it is applied to conventional printed circuits, there are major differences. One must view the printed circuit board as a planar surface designed to provide interconnections between electronic devices. The electronic in dustry is using them for mass-production techniques to join discrete, integrated, and special components (leaded and leadless). This book ap plies to all board variations including single-sided, double-sided, multi layer, and flexible circuits.
Author: RUDOLF STRAUSS
Publisher: Elsevier
ISBN: 9780080480978
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology
Author: Clyde F. Coombs
Publisher: McGraw-Hill Companies
ISBN:
Category : Printed circuits
Languages : en
Pages : 994
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Book Description
Author: Clyde Coombs
Publisher: McGraw Hill Professional
ISBN: 0071467343
Category : Technology
Languages : en
Pages : 1634
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Book Description
The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing! The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits. Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits Inside This State-of-the-Art Printed Circuits Guide • Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits
Author: Keith Brindley
Publisher: Elsevier
ISBN: 1483105377
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
Newnes Electronics Assembly Handbook
Author: John H. Lau
Publisher: Springer
ISBN:
Category : Computers
Languages : en
Pages : 732
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Book Description
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Author: Mike Judd
Publisher: Elsevier
ISBN: 1483102173
Category : Technology & Engineering
Languages : en
Pages : 300
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Book Description
Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.
Author: Indium Corporation
Publisher:
ISBN: 9781737023289
Category :
Languages : en
Pages :
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Book Description
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. Indium Corporations' Christopher Nash and Dr. Ronald C. Lasky address six top defect topics, as well as how to avoid them, including (1) voiding in bottom-termination components, (2) graping, (3) head-in-pillow and non-wet opens, (4) tombstoning of passive components, (5) insufficients, and (6) solder balling and beading. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Author: Ratan Sengupta
Publisher: Sankalp Publication
ISBN: 9395016884
Category : Education
Languages : en
Pages : 67
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Book Description
: This guide book has been prepared, based on my 35 + years’ experience on conducting training on Electronic PCB Assembly, both in the capacity of a Trainer and Consultant, solving assembly problems. I have realized that electronic manufacturing Industries, especially in MSME Sector, do not realize the fact that their system long term Reliability is a direct function of each Solder joint quality, and hence, a basic Induction training on soldering technique is absent from their HR Training Plan. Through this guide book, I have tried to share my experience with more than 300 Electronic Manufacturing Units in India, with a massage that if you wish to wish to produce Long Term Reliable System to your clients, please do not forget to emphasis on basic Manual Soldering. This book contains: 1. SOLDERING: INTRODUCTION AND BASIC THEORIES 2. SOLDERING MATERIALS (SOLDER, FLUX, CLEANING SOLVENT) 3. SOLDERING TOOLS 4. SOLDERING IRON & SOLDERING BITS 4. SAFETY PRECAUTIONS BEFORE STARTING SOLDERING PROCESS 6. STEP BY STEP SOLDERING PROCESS Part I: Through hole Component Part II: Surface Mount Devises 7.PWA INSPECTION TOOLS& EQUIPMENT 8. COMMON MANNUAL SOLDER JOINT DEFECTS & THEIR PREVENTION Annex-A: LEAD FREE SOLDERING Annex- B: BIBLOGRAPHY The book all also cover the Manual Soldering competitions, arranged by different Industry Association, like IPC.
