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Author: Andrew Marshall
Publisher: Springer Science & Business Media
ISBN: 0306481618
Category : Technology & Engineering
Languages : en
Pages : 410
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Book Description
This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Author: Andrew Marshall
Publisher: Springer Science & Business Media
ISBN: 0306481618
Category : Technology & Engineering
Languages : en
Pages : 410
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Book Description
This title introduces state-of-the-art design principles for SOI circuit design, and is primarily concerned with circuit-related issues. It considers SOI material in terms of implementation that is promising or has been used elsewhere in circuit development, with historical perspective where appropriate.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 0470030062
Category : Technology & Engineering
Languages : en
Pages : 412
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Book Description
The scaling of semiconductor devices from sub-micron to nanometer dimensions is driving the need for understanding the design of electrostatic discharge (ESD) circuits, and the response of these integrated circuits (IC) to ESD phenomena. ESD Circuits and Devices provides a clear insight into the layout and design of circuitry for protection against electrical overstress (EOS) and ESD. With an emphasis on examples, this text: explains ESD buffering, ballasting, current distribution, design segmentation, feedback, coupling, and de-coupling ESD design methods; outlines the fundamental analytical models and experimental results for the ESD design of MOSFETs and diode semiconductor device elements, with a focus on CMOS, silicon on insulator (SOI), and Silicon Germanium (SiGe) technology; focuses on the ESD design, optimization, integration and synthesis of these elements and concepts into ESD networks, as well as applying within the off-chip driver networks, and on-chip receivers; and highlights state-of-the-art ESD input circuits, as well as ESD power clamps networks. Continuing the author’s series of books on ESD, this book will be an invaluable reference for the professional semiconductor chip and system ESD engineer. Semiconductor device and process development, quality, reliability and failure analysis engineers will also find it an essential tool. In addition, both senior undergraduate and graduate students in microelectronics and IC design will find its numerous examples useful.
Author: John E. Ayers
Publisher: CRC Press
ISBN: 1439894957
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Author: Steven H. Voldman
Publisher: John Wiley & Sons
ISBN: 1119965179
Category : Technology & Engineering
Languages : en
Pages : 1172
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Book Description
A practical and comprehensive reference that explores Electrostatic Discharge (ESD) in semiconductor components and electronic systems The ESD Handbook offers a comprehensive reference that explores topics relevant to ESD design in semiconductor components and explores ESD in various systems. Electrostatic discharge is a common problem in the semiconductor environment and this reference fills a gap in the literature by discussing ESD protection. Written by a noted expert on the topic, the text offers a topic-by-topic reference that includes illustrative figures, discussions, and drawings. The handbook covers a wide-range of topics including ESD in manufacturing (garments, wrist straps, and shoes); ESD Testing; ESD device physics; ESD semiconductor process effects; ESD failure mechanisms; ESD circuits in different technologies (CMOS, Bipolar, etc.); ESD circuit types (Pin, Power, Pin-to-Pin, etc.); and much more. In addition, the text includes a glossary, index, tables, illustrations, and a variety of case studies. Contains a well-organized reference that provides a quick review on a range of ESD topics Fills the gap in the current literature by providing information from purely scientific and physical aspects to practical applications Offers information in clear and accessible terms Written by the accomplished author of the popular ESD book series Written for technicians, operators, engineers, circuit designers, and failure analysis engineers, The ESD Handbook contains an accessible reference to ESD design and ESD systems.
Author: Michel Robert
Publisher: Springer
ISBN: 0387355979
Category : Technology & Engineering
Languages : en
Pages : 489
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Book Description
The 11 th IFIP International Conference on Very Large Scale Integration, in Montpellier, France, December 3-5,2001, was a great success. The main focus was about IP Cores, Circuits and System Designs & Applications as well as SOC Design Methods and CAD. This book contains the best papers (39 among 70) that have been presented during the conference. Those papers deal with all aspects of importance for the design of the current and future integrated systems. System on Chip (SOC) design is today a big challenge for designers, as a SOC may contain very different blocks, such as microcontrollers, DSPs, memories including embedded DRAM, analog, FPGA, RF front-ends for wireless communications and integrated sensors. The complete design of such chips, in very deep submicron technologies down to 0.13 mm, with several hundreds of millions of transistors, supplied at less than 1 Volt, is a very challenging task if design, verification, debug and industrial test are considered. The microelectronic revolution is fascinating; 55 years ago, in late 1947, the transistor was invented, and everybody knows that it was by William Shockley, John Bardeen and Walter H. Brattein, Bell Telephone Laboratories, which received the Nobel Prize in Physics in 1956. Probably, everybody thinks that it was recognized immediately as a major invention.
Author: R. Dean Adams
Publisher: Springer Science & Business Media
ISBN: 0306479729
Category : Technology & Engineering
Languages : en
Pages : 252
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Book Description
Are memory applications more critical than they have been in the past? Yes, but even more critical is the number of designs and the sheer number of bits on each design. It is assured that catastrophes, which were avoided in the past because memories were small, will easily occur if the design and test engineers do not do their jobs very carefully. High Performance Memory Testing: Design Principles, Fault Modeling and Self Test is based on the author's 20 years of experience in memory design, memory reliability development and memory self test. High Performance Memory Testing: Design Principles, Fault Modeling and Self Test is written for the professional and the researcher to help them understand the memories that are being tested.
Author: Randall Fulton
Publisher: CRC Press
ISBN: 1351831429
Category : Computers
Languages : en
Pages : 254
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Book Description
Written by a Federal Aviation Administration (FAA) consultant designated engineering representative (DER) and an electronics hardware design engineer who together taught the DO-254 class at the Radio Technical Commission for Aeronautics, Inc. (RTCA) in Washington, District of Columbia, USA, Airborne Electronic Hardware Design Assurance: A Practitioner's Guide to RTCA/DO-254 is a testimony to the lessons learned and wisdom gained from many years of first-hand experience in the design, verification, and approval of airborne electronic hardware. This practical guide to the use of RTCA/DO-254 in the development of airborne electronic hardware for safety critical airborne applications: Describes how to optimize engineering processes and practices to harmonize with DO-254 Addresses the single most problematic aspect of engineering and compliance to DO-254—poorly written requirements Includes a tutorial on how to write requirements that will minimize the cost and effort of electronic design and verification Discusses the common pitfalls encountered by practitioners of DO-254, along with how those pitfalls occur and what can be done about them Settles the ongoing debate and misconceptions about the true definition of a derived requirement Promotes embracing DO-254 as the best means to achieve compliance to it, as well as the best path to high-quality electronic hardware Airborne Electronic Hardware Design Assurance: A Practitioner's Guide to RTCA/DO-254 offers real-world insight into RTCA/DO-254 and how its objectives can be satisfied. It provides engineers with valuable information that can be applied to any project to make compliance to DO-254 as easy and problem-free as possible.
Author: Suresh Chandra Satapathy
Publisher: Springer
ISBN: 8132227522
Category : Technology & Engineering
Languages : en
Pages : 749
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Book Description
The third international conference on INformation Systems Design and Intelligent Applications (INDIA – 2016) held in Visakhapatnam, India during January 8-9, 2016. The book covers all aspects of information system design, computer science and technology, general sciences, and educational research. Upon a double blind review process, a number of high quality papers are selected and collected in the book, which is composed of three different volumes, and covers a variety of topics, including natural language processing, artificial intelligence, security and privacy, communications, wireless and sensor networks, microelectronics, circuit and systems, machine learning, soft computing, mobile computing and applications, cloud computing, software engineering, graphics and image processing, rural engineering, e-commerce, e-governance, business computing, molecular computing, nano-computing, chemical computing, intelligent computing for GIS and remote sensing, bio-informatics and bio-computing. These fields are not only limited to computer researchers but also include mathematics, chemistry, biology, bio-chemistry, engineering, statistics, and all others in which computer techniques may assist.
Author: Krzysztof Iniewski
Publisher: John Wiley & Sons
ISBN: 1118181476
Category : Technology & Engineering
Languages : en
Pages : 632
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Book Description
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Author: Anantha Chandrakasan
Publisher: John Wiley & Sons
ISBN: 0780334299
Category : Technology & Engineering
Languages : en
Pages : 656
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Book Description
This collection of important papers provides a comprehensive overview of low-power system design, from component technologies and circuits to architecture, system design, and CAD techniques. LOW POWER CMOS DESIGN summarizes the key low-power contributions through papers written by experts in this evolving field.
