Author: James Paul Becker
Publisher:
ISBN:
Category :
Languages : en
Pages : 420
Book Description
Silicon Micromachined Waveguide Transitions and Three-dimensional Lithography for High Frequency Packaging
Author: James Paul Becker
Publisher:
ISBN:
Category :
Languages : en
Pages : 420
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 420
Book Description
Three Dimensional Integration and Packaging Using Silicon Micromachining
Author: Alexandros D. Margomenos
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 394
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 394
Book Description
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 896
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 896
Book Description
Microwave Micromachined Cavity Filters
Author: Lee Harle
Publisher:
ISBN:
Category :
Languages : en
Pages : 376
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 376
Book Description
International Aerospace Abstracts
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 974
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 974
Book Description
American Doctoral Dissertations
Author:
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 800
Book Description
Publisher:
ISBN:
Category : Dissertation abstracts
Languages : en
Pages : 800
Book Description
Foundations for Microstrip Circuit Design
Author: Terry C. Edwards
Publisher: John Wiley & Sons
ISBN: 1118936183
Category : Technology & Engineering
Languages : en
Pages : 688
Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Publisher: John Wiley & Sons
ISBN: 1118936183
Category : Technology & Engineering
Languages : en
Pages : 688
Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
MEMS and Microsystems
Author: Tai-Ran Hsu
Publisher: McGraw-Hill Science, Engineering & Mathematics
ISBN:
Category : Computers
Languages : en
Pages : 456
Book Description
Microsystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere.
Publisher: McGraw-Hill Science, Engineering & Mathematics
ISBN:
Category : Computers
Languages : en
Pages : 456
Book Description
Microsystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere.
National Semiconductor Metrology Program
Author: National Institute of Standards and Technology (U.S.)
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 146
Book Description
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 146
Book Description
Fundamentals of Heat and Mass Transfer
Author: Theodore L. Bergman
Publisher: John Wiley & Sons
ISBN: 9780470646151
Category : Heat
Languages : en
Pages : 1048
Book Description
This bestselling book in the field provides a complete introduction to the physical origins of heat and mass transfer. Noted for its crystal clear presentation and easy-to-follow problem solving methodology, Incropera and Dewitt's systematic approach to the first law develops reader confidence in using this essential tool for thermal analysis. Readers will learn the meaning of the terminology and physical principles of heat transfer as well as how to use requisite inputs for computing heat transfer rates and/or material temperatures.
Publisher: John Wiley & Sons
ISBN: 9780470646151
Category : Heat
Languages : en
Pages : 1048
Book Description
This bestselling book in the field provides a complete introduction to the physical origins of heat and mass transfer. Noted for its crystal clear presentation and easy-to-follow problem solving methodology, Incropera and Dewitt's systematic approach to the first law develops reader confidence in using this essential tool for thermal analysis. Readers will learn the meaning of the terminology and physical principles of heat transfer as well as how to use requisite inputs for computing heat transfer rates and/or material temperatures.