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Author: Lian Zhang
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
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Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Author: Lian Zhang
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
Get Book Here
Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Author: Lian Zhang
Publisher:
ISBN: 9783662099001
Category :
Languages : en
Pages : 152
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Book Description
Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: Adrian Bejan
Publisher: Cambridge University Press
ISBN: 9780521793889
Category : Science
Languages : en
Pages : 370
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Book Description
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
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Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Author: Sujoy Kumar Saha
Publisher: Butterworth-Heinemann
ISBN: 0128043563
Category : Science
Languages : en
Pages : 358
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Book Description
Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity. This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems. A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient. Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis. - Up-to-date information will help delineate further research direction in the microchannel heat transfer - The latest modeling information and recommendations will help in design method and purpose
Author: S. Harikrishnan
Publisher: Springer Nature
ISBN: 9811678456
Category : Science
Languages : en
Pages : 105
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Book Description
This comprehensive book focuses on the basic physical features and purpose of nanofluids and miniature heat sinks. The contents demonstrate the design modification, fabrication, experimental investigation, and various applications of miniature heat sinks. The book provides context for thermal performance of miniature heat sinks as well as summaries of experimental results correlations that reflect the current technical innovations are included. This book is a useful reference for both academia and industry alike.
Author: Michael M. Ohadi
Publisher: Springer Science & Business Media
ISBN: 1461407788
Category : Technology & Engineering
Languages : en
Pages : 124
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Book Description
In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature. Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.
Author: J.M.P.Q. Delgado
Publisher: Springer Science & Business Media
ISBN: 3642219667
Category : Technology & Engineering
Languages : en
Pages : 263
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Book Description
This book, "Heat and Mass Transfer in Porous Media", presents a set of new developments in the field of basic and applied research work on the physical and chemical aspects of heat and mass transfer phenomena in a porous medium domain, as well as related material properties and their measurements. The book contents include both theoretical and experimental developments, providing a self-contained major reference that is appealing to both the scientists and the engineers. At the same time, these topics will encounter of a variety of scientific and engineering disciplines, such as chemical, civil, agricultural, mechanical engineering, etc. The book is divided in several chapters that intend to be a short monograph in which the authors summarize the current state of knowledge for benefit of professionals.
Author: Frank P. Incropera
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Liquid Cooling of Electronic Devices by Single-Phase Convection offers the first comprehensive and in-depth coverage of liquid convection as it applies to state-of-the-art thermal management systems. In this book, Dr. Incropera culls ten years of research results, clarifies the physical mechanisms associated with single-phase convection in the context of electronic cooling, and provides working engineers with a solid foundation for the design and development of rational liquid cooling systems. For those involved in designing these products - mechanical and electrical engineers, electronic packaging engineers, technical staff, and others - this book provides an invaluable road map to meet the challenge.
