Author: Johann-Friedrich Luy
Publisher: Springer Science & Business Media
ISBN: 3642790313
Category : Technology & Engineering
Languages : en
Pages : 359
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Book Description
A description of field-theoretical methods for the design and analysis of planar waveguide structures and antennas. The principles and limitations of transit-time devices with different injection mechanisms are covered, as are aspects of fabrication and characterization. The physical properties of silicon Schottky contacts and diodes are treated in a separate chapter, while two whole chapters are devoted to silicon/germanium devices. The integration of devices in monolithic circuits is explained together with advanced technologies, such as the self-mixing oscillator operation, before concluding with sensor and system applications.
Author: Ali M. Niknejad
Publisher: Springer Science & Business Media
ISBN: 0387765611
Category : Technology & Engineering
Languages : en
Pages : 313
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Book Description
This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 9780470742952
Category : Technology & Engineering
Languages : en
Pages : 850
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Book Description
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Author: Andrej Rumiantsev
Publisher:
ISBN: 9788770043564
Category : Science
Languages : en
Pages : 0
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Book Description
This book presents solutions for accurate mm-wave characterization of advanced semiconductor devices. It guides through the process of development, implementation and verification of the in-situ calibration methods optimized for high-performance silicon technologies.
Author:
Publisher: Academic Press
ISBN: 0123946360
Category : Technology & Engineering
Languages : en
Pages : 521
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Book Description
Advances in Imaging and Electron Physics merges two long-running serials--Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains. - Contributions from leading authorities - Informs and updates on all the latest developments in the field
Author: Gernot Hueber
Publisher: Cambridge University Press
ISBN: 1108757510
Category : Technology & Engineering
Languages : en
Pages : 455
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Book Description
Discover the concepts, architectures, components, tools, and techniques needed to design millimeter-wave circuits for current and emerging wireless system applications. Focusing on applications in 5G, connectivity, radar, and more, leading experts in radio frequency integrated circuit (RFIC) design provide a comprehensive treatment of cutting-edge physical-layer technologies for radio frequency (RF) transceivers - specifically RF, analog, mixed-signal, and digital circuits and architectures. The full design chain is covered, from system design requirements through to building blocks, transceivers, and process technology. Gain insight into the key novelties of 5G through authoritative chapters on massive MIMO and phased arrays, and learn about the very latest technology developments, such as FinFET logic process technology for RF and millimeter-wave applications. This is an essential reading and an excellent reference for high-frequency circuit designers in both academia and industry.
Author: Stefan Lindenmeier
Publisher: Springer Science & Business Media
ISBN: 3642183751
Category : Technology & Engineering
Languages : en
Pages : 378
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Book Description
This volume provides a discussion of the challenges and perspectives of electromagnetics and network theory and their microwave applications in all aspects. It collects the most interesting contribution of the symposium dedicated to Professor Peter Russer held in October 2009 in Munich.
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: Zheng You
Publisher: World Scientific
ISBN: 9813232811
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
This book collects selected papers from the 17th and 18th Annual Conference of the Chinese Society of Micro/Nano Technology (CSMNT2015 and CSMNT2016).The papers cover various fields, like Micro/Nano Transducer/Robot, Microfluidic Devices and Systems, Micro/Nano Fabrication & Measurement Technologies, Microfluidics and Nano Fluids, Nano Material Research/Nanotube/Nanowire Devices, MEMS/NENS and Applications, Nanometer Biological/Nano Medicine, Packaging Technology. All the papers are written by Chinese researchers. From this book, you can have an overview of research of MEMS and nano technology in China. The reader can be researchers, graduate students, and engineers who are working in the field of MEMS and nano technology.
Author: Vadim Issakov
Publisher: Springer Science & Business Media
ISBN: 3642135986
Category : Technology & Engineering
Languages : en
Pages : 218
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Book Description
There are continuous efforts focussed on improving road traffic safety worldwide. Numerous vehicle safety features have been invented and standardized over the past decades. Particularly interesting are the driver assistance systems, since these can considerably reduce the number of accidents by supporting drivers’ perception of their surroundings. Many driver assistance features rely on radar-based sensors. Nowadays the commercially available automotive front-end sensors are comprised of discrete components, thus making the radar modules highly-priced and suitable for integration only in premium class vehicles. Realization of low-cost radar fro- end circuits would enable their implementation in inexpensive economy cars, c- siderably contributing to traffic safety. Cost reduction requires high-level integration of the microwave front-end c- cuitry, specifically analog and digital circuit blocks co-located on a single chip. - cent developments of silicon-based technologies, e.g. CMOS and SiGe:C bipolar, make them suitable for realization of microwave sensors. Additionally, these te- nologies offer the necessary integration capability. However, the required output power and temperature stability, necessary for automotive radar sensor products, have not yet been achieved in standard digital CMOS technologies. On the other hand, SiGe bipolar technology offers excellent high-frequency characteristics and necessary output power for automotive applications, but has lower potential for - alization of digital blocks than CMOS.
