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Author: Shyam P. Murarka
Publisher: Academic Press
ISBN: 0080570569
Category : Technology & Engineering
Languages : en
Pages : 213
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Book Description
Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.
Author: Shyam P. Murarka
Publisher: Academic Press
ISBN: 0080570569
Category : Technology & Engineering
Languages : en
Pages : 213
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Book Description
Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 9780824787837
Category : Technology & Engineering
Languages : en
Pages : 1186
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Book Description
The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Author: S. P. Murarka
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 200
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Book Description
Author: Victor E. Borisenko
Publisher: Springer Science & Business Media
ISBN: 3642596495
Category : Technology & Engineering
Languages : en
Pages : 362
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Book Description
A comprehensive presentation and analysis of properties and methods of formation of semiconducting silicides. Fundamental electronic, optical and transport properties of the silicides collected from recent publications will help readers choose their application in new generations of solid-state devices. A comprehensive presentation of thermodynamic and kinetic data is given in combination with their technical application, as is information on corresponding thin-film or bulk crystal formation techniques.
Author: D. Chattopadhyay
Publisher: New Age International
ISBN: 9788122417807
Category : Electronic engineering
Languages : en
Pages : 652
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Book Description
The Book Is Meant For The Students Pursuing A Beginners' Course In Electronics. Current Syllabi Of Basic Electronics Included In Physics (Honours) Curriculum Of Different Universities And Those Offered In Various Engineering And Technical Institutions Have Been Consulted In Preparing The Material Contained Herein.In 22 Chapters, The Book Deals With Formation Of Energy Bands In Solids; Electron Emission From Solid Surfaces; Vacuum Tubes; Properties Of Semiconductors; Pn Junction Diodes; Rectifiers; Voltage Multipliers; Clipping And Clamping Circuits; Bipolar Junction Transistors; Basic Voltage And Poweramplifiers; Feedback In Amplifiers; Regulated Power Supply; Sinusoidal Oscillators; Multivibrators; Modulation And Demodulation; Jfet And Mosfet; Ics; Op Amps; Special Semiconductor Devices, Such As Phototransistor, Scr, Triac, Diac, Ujt, Impatt Diode, Gunn Diode, Pin Diode, Igbt; Digital Circuits; Cathode Ray Oscilloscope; Radio Communication; Television; Radar And Laser.Fundamental Principles And Applications Are Discussed Herein With Explanatory Diagrams In A Clear Concise Way.Physical Aspects Are Emphasized; Mathematical Details Are Given, When Necessary. Many Of The Problems And Review Questions Included In The Book Are Taken From Recent Examination Papers. Some Objective-Type Questions Typically Set In Different Competitive Examinations Are Also Given At The End Of Each Chapter.Salient Features: * Small Geometry Effects And Effects Of Interconnects Included In Chapter 18. * A Quick Discussion On Fibre Optic Communication System In Chapter 22. * Revised And Updated To Cope With The Current Syllabii Of Some More Universities And Technical Institutions. * Chapters 6, 8, 16, 18, And 22 Have Been Changed With The Addition Of New Material. * Some More University Questions And Problems Have Been Included.
Author: Jaydeep Sarkar
Publisher: William Andrew
ISBN: 0815519877
Category : Technology & Engineering
Languages : en
Pages : 614
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Book Description
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . - Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements - Practical information on technology trends, role of sputtering and major OEMs - Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. - Practical case-studies on target performance and troubleshooting - Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry
Author: Norman Einspruch
Publisher: Academic Press
ISBN: 0323141994
Category : Technology & Engineering
Languages : en
Pages : 929
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Book Description
VLSI Handbook is a reference guide on very large scale integration (VLSI) microelectronics and its aspects such as circuits, fabrication, and systems applications. This handbook readily answers specific questions and presents a systematic compilation of information regarding the VLSI technology. There are a total of 52 chapters in this book and are grouped according to the fields of design, materials and processes, and examples of specific system applications. Some of the chapters under fields of design are design automation for integrated circuits and computer tools for integrated circuit design. For the materials and processes, there are many chapters that discuss this aspect. Some of them are manufacturing process technology for metal-oxide semiconductor (MOS) VLSI; MOS VLSI circuit technology; and facilities for VLSI circuit fabrication. Other concepts and materials discussed in the book are the use of silicon material in different processes of VLSI, nitrides, silicides, metallization, and plasma. This handbook is very useful to students of engineering and physics. Also, researchers (in physics and chemistry of materials and processes), device designers, and system designers can also benefit from this book.
Author: Yu Huang
Publisher: CRC Press
ISBN: 981430347X
Category : Science
Languages : en
Pages : 472
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Book Description
Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering
Author: Institution of Electrical Engineers
Publisher: IET
ISBN: 9780863413520
Category : Social Science
Languages : en
Pages : 302
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Book Description
This is the first book to provide guidance on the development and application of metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages. Other key topics covered are fundamentals, present and future silicide technology for Si-based devices, and characterisation methods. Suitable for engineers and students in microelectronics.
Author: Norman G. Einspruch
Publisher: Academic Press
ISBN: 1483217817
Category : Technology & Engineering
Languages : en
Pages : 491
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Book Description
VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
