Signal Integrity Characterization Techniques PDF Download
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Author: Mike Resso
Publisher: Intl. Engineering Consortiu
ISBN: 9781931695930
Category : Science
Languages : en
Pages : 812
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Book Description
Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
Author: Mike Resso
Publisher: Intl. Engineering Consortiu
ISBN: 9781931695930
Category : Science
Languages : en
Pages : 812
Get Book Here
Book Description
Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
Author: Eric Bogatin
Publisher:
ISBN: 9781732567023
Category :
Languages : en
Pages :
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Book Description
Author: Eric Bogatin
Publisher: Pearson Education
ISBN: 0132349795
Category : Technology & Engineering
Languages : en
Pages : 793
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Book Description
With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
Author: Spartaco Caniggia
Publisher: John Wiley & Sons
ISBN: 0470772883
Category : Science
Languages : en
Pages : 552
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Book Description
Before putting digital systems for information technology or telecommunication applications on the market, an essential requirement is to perform tests in order to comply with the limits of radiated emission imposed by the standards. This book provides an investigation into signal integrity (SI) and electromagnetic interference (EMI) problems. Topics such as reflections, crosstalk, switching noise and radiated emission (RE) in high-speed digital systems are covered, which are essential for IT and telecoms applications. The highly important topic of modelling is covered which can reduce costs by enabling simulation data to demonstrate that a product meets design specifications and regulatory limits. According to the new European EMC directive, this can help to avoid the expensive use of large semi-anechoic chambers or open area test sites for radiated emission assessments. Following a short introduction to signalling and radiated interference in digital systems, the book provides a detailed characterization of logic families in terms of static and dynamic characteristic useful for modelling techniques. Crosstalk in multi-coupled line structures are investigated by analytical, graphical and circuit-based methods, and techniques to mitigate these phenomena are provided. Grounding, filtering and shielding with multilayer PCBs are also examined and design rules given. Written by authors with extensive experience in industry and academia. Explains basic conceptual problems from a theoretical and practical point of view by using numerous measurements and simulations. Presents models for mathematical and SPICE-like circuit simulators. Provides examples of using full-wave codes for SI and RE investigations. Companion website containing lists of codes and sample material. Signal Integrity and Radiated Emission of High-Speed Digital Systems is a valuable resource to industrial designers of information technology, telecommunication equipment and automation equipment as well as to development engineers. It will also be of interest to managers and designers of consumer electronics, and researchers in electronics.
Author: Eric Bogatin
Publisher: Artech House
ISBN: 1630816922
Category : Technology & Engineering
Languages : en
Pages : 603
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Book Description
This multimedia eBook establishes a solid foundation in the essential principles of how signals interact with transmission lines, how the physical design of interconnects affects transmission line properties, and how to interpret single-ended and differential time domain reflection (TDR) measurements to extract important figures of merits and avoid common mistakes. This book presents an intuitive understanding of transmission lines. Instructional videos are provided in every chapter that cover important aspects of the interconnect design and characterization process. This video eBook helps establish foundations for designing and characterizing the electrical properties of interconnects to explain in a simplified way how signals propagate and interact with interconnects and how the physical design of transmission structures will impact performance. Never be intimidated by impedance or differential pairs again.
Author: Peter J. Pupalaikis
Publisher: Cambridge University Press
ISBN: 1108808344
Category : Technology & Engineering
Languages : en
Pages : 667
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Book Description
Master the usage of s-parameters in signal integrity applications and gain full understanding of your simulation and measurement environment with this rigorous and practical guide. Solve specific signal integrity problems including calculation of the s-parameters of a network, linear simulation of circuits, de-embedding, and virtual probing, all with expert guidance. Learn about the interconnectedness of s-parameters, frequency responses, filters, and waveforms. This invaluable resource for signal integrity engineers is supplemented with the open-source software SignalIntegrity, a Python package for scripting solutions to signal integrity problems.
Author: Brian Young
Publisher: Prentice Hall
ISBN:
Category : Computers
Languages : en
Pages : 570
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Book Description
State-of-the-art techniques for predicting and achieving target performance levels Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether you're modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues Multiconductor interconnects: packages, sockets, connectors and buses Modal decomposition: understanding the outputs generated by commercial modeling software Layer peeling with time-domain reflectometry: its power and limitations Experimental techniques for characterizing interconnect parasitics In Digital Signal Integrity, Motorola senior engineer Brian Young presents broad coverage of modeling from data obtained through electromagnetic simulation, transmission line theory, frequency and time-domain modeling, analog circuit simulation, digital signaling, and architecture. Young offers a strong mathematical foundation for every technique, as well as over 100 end-of-chapter problems. If you're stretching the performance envelope, you must be able to rely on your models and simulations. With this book, you can.
Author: Mike Peng Li
Publisher: Pearson Education
ISBN: 0132797194
Category : Technology & Engineering
Languages : en
Pages : 443
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Book Description
State-of-the-art JNB and SI Problem-Solving: Theory, Analysis, Methods, and Applications Jitter, noise, and bit error (JNB) and signal integrity (SI) have become today‘s greatest challenges in high-speed digital design. Now, there’s a comprehensive and up-to-date guide to overcoming these challenges, direct from Dr. Mike Peng Li, cochair of the PCI Express jitter standard committee. One of the field’s most respected experts, Li has brought together the latest theory, analysis, methods, and practical applications, demonstrating how to solve difficult JNB and SI problems in both link components and complete systems. Li introduces the fundamental terminology, definitions, and concepts associated with JNB and SI, as well as their sources and root causes. He guides readers from basic math, statistics, circuit and system models all the way through final applications. Emphasizing clock and serial data communications applications, he covers JNB and SI simulation, modeling, diagnostics, debugging, compliance testing, and much more.
Author: Vishram S. Pandit
Publisher: Pearson Education
ISBN: 0132596962
Category : Technology & Engineering
Languages : en
Pages : 466
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Book Description
Foreword by Joungho Kim The Hands-On Guide to Power Integrity in Advanced Applications, from Three Industry Experts In this book, three industry experts introduce state-of-the-art power integrity design techniques for today’s most advanced digital systems, with real-life, system-level examples. They introduce a powerful approach to unifying power and signal integrity design that can identify signal impediments earlier, reducing cost and improving reliability. After introducing high-speed, single-ended and differential I/O interfaces, the authors describe on-chip, package, and PCB power distribution networks (PDNs) and signal networks, carefully reviewing their interactions. Next, they walk through end-to-end PDN and signal network design in frequency domain, addressing crucial parameters such as self and transfer impedance. They thoroughly address modeling and characterization of on-chip components of PDNs and signal networks, evaluation of power-to-signal coupling coefficients, analysis of Simultaneous Switching Output (SSO) noise, and many other topics. Coverage includes The exponentially growing challenge of I/O power integrity in high-speed digital systems PDN noise analysis and its timing impact for single-ended and differential interfaces Concurrent design and co-simulation techniques for evaluating all power integrity effects on signal integrity Time domain gauges for designing and optimizing components and systems Power/signal integrity interaction mechanisms, including power noise coupling onto signal trace and noise amplification through signal resonance Performance impact due to Inter Symbol Interference (ISI), crosstalk, and SSO noise, as well as their interactions Validation techniques, including low impedance VNA measurements, power noise measurements, and characterization of power-to-signal coupling effects Power Integrity for I/O Interfaces will be an indispensable resource for everyone concerned with power integrity in cutting-edge digital designs, including system design and hardware engineers, signal and power integrity engineers, graduate students, and researchers.
Author: Qian Li
Publisher:
ISBN:
Category :
Languages : en
Pages : 342
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Book Description
The development of modern digital communication systems has been entered a new era with faster signal transmission and processing capability, called high-speed circuit systems. As their clock frequencies have increased and rise times of signals have decreased, the signal integrity of interconnects in the packaging and printed circuit boards plays a more and more important role. In high-speed circuit systems, the well-designed logic functions most likely will not work well if their interconnects are not taken into account. This dissertation addresses to profoundly understand the signal integrity knowledge, be proficient in calculation, simulation and measurements, and be capable of solving related signal integrity problems. The research mainly emphasizes on three aspects. First of all, the impact of on-wafer calibration methods on the measured results of coplanar waveguide circuits is comprehensively investigated, with their measurement repeatability and accuracy. Furthermore, a method is presented to characterize the physically-consistent broadband material properties for both rigid and flexible dielectric materials. Last but not least, a hybrid method for efficient modeling of three dimensional via structures is developed, in order to simplify the traditional 3D full-length via simulations and dramatically reduce the via build and simulation time and complexity.
