Author:
Publisher: Pearson Education South Asia
ISBN: 9789812478382
Category : Physics
Languages : en
Pages : 156

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Author:
Publisher: Pearson Education South Asia
ISBN: 9789812478504
Category : Physics
Languages : en
Pages : 124

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Author: Andrea Bonarini
Publisher: Springer Science & Business Media
ISBN: 3790817686
Category : Computers
Languages : en
Pages : 231

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Book Description
The papers collected in this book are concerned with the application of the so-called "soft-computing" techniques to the aim of defining flexible systems. The topics covered witness the actual research trend towards an integration of distinct formal techniques for defining flexible systems. The contributions in this volume mainly concern the definition of systems in several application fields, such as image processing, control, asset allocation, medicine, time series forecasting, qualitative modeling, support to design, reliability analysis, diagnosis, filtering, data analysis, land mines detection and so forth. The papers presented in this volume are organized into three main thematic sections: Fuzzy Systems, Neural Networks and Genetic and Evolutionary Algorithms, although, as outlined before, some works employ more than one technique from these fields.

Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979

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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 2

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Author: Loo & Loo
Publisher: Pearson Education South Asia
ISBN: 9789810603229
Category : Physics
Languages : en
Pages : 114

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Author: J. Oscar Blew
Publisher:
ISBN:
Category : Wood
Languages : en
Pages : 26

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Author:
Publisher:
ISBN: 9781423572381
Category :
Languages : en
Pages : 605

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Book Description
This handbook is designed to aid electronic warfare and radar systems engineers in making general estimations regarding capabilities of systems. It is not intended as a detailed designer's guide, due to space limitations. Portions of the handbook and future changes will be posted on an internet link.

Author: Dwight Deugo
Publisher: Cambridge University Press
ISBN: 0521774772
Category : Computers
Languages : en
Pages : 506

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Book Description
This book presents the best articles and columns published in Java Report between 1997 and 1999. Each article is independent of any specific version of Java and relies mainly on those classes that are now part of the standard Java class library and APIs. Also, each article and column discusses Java topics and implementations that are not readily available in a single book. The book serves as an excellent reference to anyone involved with Java. The reader can learn more about the language, perform analysis, design and modeling, work on specific implementations, check performance, and perform testing. This book presents the good ideas of people who have used Java for "Real" applications.

Author:
Publisher:
ISBN:
Category : Armor
Languages : en
Pages : 216

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