Author: International Conference on Computer Technology in Welding. 7, 1997, San Francisco, Calif..
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Seventh International Conference on Computer Technology in Welding
Author: International Conference on Computer Technology in Welding. 7, 1997, San Francisco, Calif..
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Seventh International Conference on Computer Technology in Welding
Author: T. A. Siewert
Publisher:
ISBN: 9780160567018
Category : Welding
Languages : en
Pages : 584
Book Description
Publisher:
ISBN: 9780160567018
Category : Welding
Languages : en
Pages : 584
Book Description
Seventh International Conference on Computer Technology in Welding
Author: T. Siewert
Publisher:
ISBN:
Category :
Languages : en
Pages : 584
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 584
Book Description
Seventh International Conference on Computer Technology in Welding
Author: T. A. Siewert
Publisher:
ISBN:
Category : Welding
Languages : en
Pages : 584
Book Description
Publisher:
ISBN:
Category : Welding
Languages : en
Pages : 584
Book Description
Computer technology in welding
Author: T. Siewert
Publisher:
ISBN:
Category :
Languages : en
Pages : 584
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 584
Book Description
Microjoining and Nanojoining
Author: Y N Zhou
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835
Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835
Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
International Conference on Computer Technology in Welding
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Ninth International Conference on Computer Technology in Welding
Author: T. Siewert
Publisher:
ISBN: 9780756733995
Category :
Languages : en
Pages : 534
Book Description
Proceedings of the 9th conference in this series, held Sept. 28-30, 1999, in Detroit, MI, under the sponsorship of the American Welding Soc., NIST, and The Welding Institute. There were 57 papers grouped into sessions on resistance weld simulation, simulation of gas metal arc welding, modeling of weld shape and distortion, modeling of solidification, general modeling, welding documentation, sensing and control of arc quality, droplet control and process automation, automation communication and interfaces, and documentation and database applications. These proceedings include the 39 printed manuscripts that were submitted (including the viewgraphs from the two tutorials on weld cell communication issues and on web page design).
Publisher:
ISBN: 9780756733995
Category :
Languages : en
Pages : 534
Book Description
Proceedings of the 9th conference in this series, held Sept. 28-30, 1999, in Detroit, MI, under the sponsorship of the American Welding Soc., NIST, and The Welding Institute. There were 57 papers grouped into sessions on resistance weld simulation, simulation of gas metal arc welding, modeling of weld shape and distortion, modeling of solidification, general modeling, welding documentation, sensing and control of arc quality, droplet control and process automation, automation communication and interfaces, and documentation and database applications. These proceedings include the 39 printed manuscripts that were submitted (including the viewgraphs from the two tutorials on weld cell communication issues and on web page design).
Ninth International Conference on Computer Technology in Welding
Author: T. Siewert
Publisher:
ISBN: 9780160592829
Category : Welding
Languages : en
Pages : 544
Book Description
Publisher:
ISBN: 9780160592829
Category : Welding
Languages : en
Pages : 544
Book Description
Eleventh International Conference on Computer Technology in Welding
Author: International Conference on Computer Technology in Welding. 11, 2001, Columbus, Ohio
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description