Sensing, Modeling, and Simulation in Emerging Electronic Packaging PDF Download
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Author: Charles Ume
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 142
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Book Description
Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p
Author: Charles Ume
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 142
Get Book
Book Description
Presents 15 papers from the November 1996 congress reflecting the state-of-the-art modeling, simulation, and sensing technologies used in emerging electronic packaging applications, especially flip chip and ball grid array (BGA). Subjects include curing analysis of a flip- chip-on-board electronic p
Author: Shen Liu
Publisher: John Wiley & Sons
ISBN: 0470828412
Category : Technology & Engineering
Languages : en
Pages : 586
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Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author: G.Q. Zhang
Publisher: Springer Science & Business Media
ISBN: 1402049358
Category : Technology & Engineering
Languages : en
Pages : 566
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Book Description
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Author: Ronald K. Jurgen
Publisher:
ISBN:
Category : Automobiles
Languages : en
Pages : 540
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Book Description
Author:
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 594
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Book Description
Author: Kikuo Kishimoto
Publisher:
ISBN:
Category : Fracture mechanics
Languages : en
Pages : 876
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Book Description
The Far East and Oceanic Fracture Society (FEOFS) and the Center for Physics and Chemistry of Fracture and Failure Prevention (PCFP) jointly organized as a series pair of each conference, FEOFS 2003 and 2nd ICPCF, on October 20-22 at Tohoku University, Sendai, Japan.
Author: Hengyun Zhang
Publisher: Woodhead Publishing
ISBN: 0081025335
Category : Technology & Engineering
Languages : en
Pages : 436
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Book Description
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging
Author: Mohamed Gad-el-Hak
Publisher: CRC Press
ISBN: 1420036556
Category : Technology & Engineering
Languages : en
Pages : 568
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Book Description
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection of MEMS knowledge available, packaged in an attractive slipcase and offered at a substantial savings. This best-selling handbook is now more convenient than ever, and its coverage is unparalleled. The third volume, MEMS: Applications, offers a broad overview of current, emerging, and possible future MEMS applications. It surveys inertial sensors, micromachined pressure sensors, surface micromachined devices, microscale vacuum pumps, reactive control for skin-friction reduction, and microchannel heat sinks, among many others. Two new chapters discuss microactuators and nonlinear electrokinetic devices. This book is vital to understanding the current and possible capabilities of MEMS technologies. MEMS: Applications comprises contributions from the foremost experts in their respective specialties from around the world. Acclaimed author and expert Mohamed Gad-el-Hak has again raised the bar to set a new standard for excellence and authority in the fledgling fields of MEMS and nanotechnology.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 576
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Book Description
Author: YongAn Huang
Publisher: Springer
ISBN: 981133627X
Category : Technology & Engineering
Languages : en
Pages : 287
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Book Description
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
