Semiconductor Wafer Bonding VII : Science, Technology, and Applications PDF Download
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Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 404
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Author:
Publisher:
ISBN: 9780780376496
Category : Electronic apparatus and appliances
Languages : en
Pages : 645
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 1566776546
Category : Microelectromechanical systems
Languages : en
Pages : 588
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Book Description
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author: C. Colinge
Publisher: The Electrochemical Society
ISBN: 1566778239
Category : Science
Languages : en
Pages : 656
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Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
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Book Description
Author: International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Publisher:
ISBN: 9781566770682
Category : Technology & Engineering
Languages : en
Pages : 485
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Book Description
Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 3662108275
Category : Science
Languages : en
Pages : 510
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Book Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.