Semiconductor Wafer Bonding : Science, Technology, and Applications V PDF Download
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Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
Get Book Here
Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Author: C. S. Tan
Publisher: The Electrochemical Society
ISBN: 1607688514
Category : Science
Languages : en
Pages : 258
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Book Description
Author: C. Colinge
Publisher: The Electrochemical Society
ISBN: 1566778239
Category : Science
Languages : en
Pages : 656
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Book Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774604
Category : Microelectromechanical systems
Languages : en
Pages : 476
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 1566776546
Category : Microelectromechanical systems
Languages : en
Pages : 588
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Book Description
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Author: Helmut Baumgart
Publisher: The Electrochemical Society
ISBN: 156677506X
Category : Microelectromechanical systems
Languages : en
Pages : 398
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Book Description
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 3662108275
Category : Science
Languages : en
Pages : 510
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Book Description
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
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Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
