Semiconductor Technology (ISTC 2001) PDF Download
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Author: Ming Yang
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 664
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Book Description
Author: Ming Yang
Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 664
Get Book Here
Book Description
Author: Ming Yang
Publisher:
ISBN: 9781566773249
Category : Semiconductors
Languages : en
Pages : 0
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 920
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Book Description
Author: Yikai Zhou
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 514
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Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 106
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Book Description
Author:
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 926
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Book Description
Author: International Conference on Semiconductor Technology
Publisher:
ISBN: 9781566773232
Category :
Languages : en
Pages : 646
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Book Description
Author:
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 572
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Book Description
Author:
Publisher:
ISBN:
Category : Plasma radiation
Languages : en
Pages : 194
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Book Description
Author: Banqiu Wu
Publisher: McGraw Hill Professional
ISBN: 007174195X
Category : Technology & Engineering
Languages : en
Pages : 544
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Book Description
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
