Semiconductor and Integrated Circuit Fabrication Techniques PDF Download
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Author: Peter E. Gise
Publisher:
ISBN: 9780879096687
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
Author: Peter E. Gise
Publisher:
ISBN: 9780879096687
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
Author: Shiban Tiku
Publisher: CRC Press
ISBN: 9814669318
Category : Science
Languages : en
Pages : 706
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Book Description
GaAs processing has reached a mature stage. New semiconductor compounds are emerging that will dominate future materials and device research, although the processing techniques used for GaAs will still remain relevant. This book covers all aspects of the current state of the art of III-V processing, with emphasis on HBTs. It is aimed at practicing
Author: Hong Xiao
Publisher:
ISBN: 9780130224040
Category : Semiconductor industry
Languages : en
Pages : 0
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Book Description
For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow. This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view.
Author: Shubham Kumar
Publisher: CRC Press
ISBN: 1000396401
Category : Technology & Engineering
Languages : en
Pages : 353
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Book Description
This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material. Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.
Author: Artur Balasinski
Publisher: CRC Press
ISBN: 1439817154
Category : Computers
Languages : en
Pages : 249
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Book Description
Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Author: Gary S. May
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
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Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Author: Peter Van Zant
Publisher: McGraw Hill Professional
ISBN: 0071501398
Category : Technology & Engineering
Languages : en
Pages : 658
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Book Description
The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. * NEW chapter on nanotechnology * NEW sections on 300mm wafer processing * Processes and devices, and Green processing * Every chapter updated to reflect the latest processing techniques
Author: Jeorge S. Hurtarte
Publisher: Elsevier
ISBN: 008055119X
Category : Technology & Engineering
Languages : en
Pages : 294
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Book Description
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. "Fabless ICs are those designed and marketed by one company but actually manufactured by another.*Written by board members of the Fabless Semiconductor Association, an industry consortium that include Xilinx, Intersil, Micro Linear, and many other members*Approriate for a wide range of integrated circuit (IC) designers and users who need to understand the fabless process and its advantages/limitations*Discusses important topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Yu Song
Publisher: John Wiley & Sons
ISBN: 3527344977
Category : Technology & Engineering
Languages : en
Pages : 771
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Book Description
Learn more about foundational and advanced topics in polymer thin films and coatings besides species with this powerful two-volume resource The two-volume Inorganic and Organic Thin Films: Fundamentals, Fabrication, and Applications delivers a foundational resource for current researchers and commercial users involved in the design and fabrication of thin films. The book offers newcomers to the field a thorough description of new design theory, fabrication methods, and applications of advanced thin films. Readers will discover the physics and chemistry underlying the manufacture of new thin films and coatings in this leading new resource that promises to become a handbook for future applications of the technology. This one-stop reference brings together all important aspects of inorganic and polymeric thin films and coatings, including construction, assembly, deposition, functionality, patterning, and characterization. Explorations of their applications in industries as diverse as information technology, new energy, biomedical engineering, aerospace, and oceanographic engineering round out this fulsome exploration of one of the most exciting and rapidly developing areas of scientific and industrial research today. Readers will also learn from: A comprehensive introduction to the progress of thin films and coatings as well as fundamentals in functional thin films and coatings An exploration of multi-layered magnetic thin films for electron transport control and signal sensing, including giant magnetoresistance, colossal magnetoresistance, tunneling magnetoresistance, and the quantum anomalous Holzer effect An in time summary of high-quality magneto-optics, nanophotonics, spin waves and spintronics using bismuth-substituted iron garnet thin films as examples A thorough discussion of template-assisted fabrication of nanostructure thin films for ultrasensitive detection of chemicals and biomolecules A treatment of biomass derived functional films and coatings Perfect for materials scientists and inorganic chemists, Inorganic and Organic Thin Films will also earn a place in the libraries of solid state physicists and physical chemists working in private industry, as well as polymer and surface chemists who seek to improve their understanding of thin films and coatings.
