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Author: Naveed A. Sherwani
Publisher: John Wiley & Sons
ISBN: 9780780310896
Category : Education
Languages : en
Pages : 386
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Book Description
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Author: Naveed A. Sherwani
Publisher: John Wiley & Sons
ISBN: 9780780310896
Category : Education
Languages : en
Pages : 386
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Book Description
This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
Author: Christian Harder
Publisher: ESRI Press
ISBN: 9781589484870
Category : Computers
Languages : en
Pages : 172
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Book Description
This is a hands-on book about ArcGIS that you work with as much as read. By the end, using Learn ArcGIS lessons, you'll be able to say you made a story map, conducted geographic analysis, edited geographic data, worked in a 3D web scene, built a 3D model of Venice, and more.
Author: Vanderlei Bonato
Publisher: Springer
ISBN: 331930481X
Category : Computers
Languages : en
Pages : 374
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Book Description
This book constitutes the refereed proceedings of the 12th International Symposium on Applied Reconfigurable Computing, ARC 2016, held in Rio de Janeiro, Brazil, in March 2016. The 20 full papers presented in this volume were carefully reviewed and selected from 47 submissions. They are organized in topical headings named: video and image processing; fault-tolerant systems; tools and architectures; signal processing; and multicore systems. In addition, the book contains 3 invited papers and 8 poster papers on funded RD running and completed projects.
Author: Sisi Zlatanova
Publisher: CRC Press
ISBN: 1134100906
Category : Technology & Engineering
Languages : en
Pages : 630
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Book Description
Disaster management is generally understood to consist of four phases: mitigation, preparedness, response and recovery. While these phases are all important and interrelated, response and recovery are often considered to be the most critical in terms of saving lives. Response is the acute phase occurring after the event, and includes all arrangemen
Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Category : Technology & Engineering
Languages : en
Pages : 181
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Book Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Author:
Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397
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Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Author: Hideharu Amano
Publisher: Springer
ISBN: 9811308241
Category : Computers
Languages : en
Pages : 234
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Book Description
This comprehensive textbook on the field programmable gate array (FPGA) covers its history, fundamental knowledge, architectures, device technologies, computer-aided design technologies, design tools, examples of application, and future trends. Programmable logic devices represented by FPGAs have been rapidly developed in recent years and have become key electronic devices used in most IT products. This book provides both complete introductions suitable for students and beginners, and high-level techniques useful for engineers and researchers in this field. Differently developed from usual integrated circuits, the FPGA has unique structures, design methodologies, and application techniques. Allowing programming by users, the device can dramatically reduce the rising cost of development in advanced semiconductor chips. The FPGA is now driving the most advanced semiconductor processes and is an all-in-one platform combining memory, CPUs, and various peripheral interfaces. This book introduces the FPGA from various aspects for readers of different levels. Novice learners can acquire a fundamental knowledge of the FPGA, including its history, from Chapter 1; the first half of Chapter 2; and Chapter 4. Professionals who are already familiar with the device will gain a deeper understanding of the structures and design methodologies from Chapters 3 and 5. Chapters 6–8 also provide advanced techniques and cutting-edge applications and trends useful for professionals. Although the first parts are mainly suitable for students, the advanced sections of the book will be valuable for professionals in acquiring an in-depth understanding of the FPGA to maximize the performance of the device.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Krzysztof Iniewski
Publisher: John Wiley & Sons
ISBN: 1118468643
Category : Technology & Engineering
Languages : en
Pages : 314
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Book Description
Covers the significant embedded computing technologies highlighting their applications in wireless communication and computing power An embedded system is a computer system designed for specific control functions within a larger system often with real-time computing constraints. It is embedded as part of a complete device often including hardware and mechanical parts. Presented in three parts, Embedded Systems: Hardware, Design, and Implementation provides readers with an immersive introduction to this rapidly growing segment of the computer industry. Acknowledging the fact that embedded systems control many of today's most common devices such as smart phones, PC tablets, as well as hardware embedded in cars, TVs, and even refrigerators and heating systems, the book starts with a basic introduction to embedded computing systems. It hones in on system-on-a-chip (SoC), multiprocessor system-on-chip (MPSoC), and network-on-chip (NoC). It then covers on-chip integration of software and custom hardware accelerators, as well as fabric flexibility, custom architectures, and the multiple I/O standards that facilitate PCB integration. Next, it focuses on the technologies associated with embedded computing systems, going over the basics of field-programmable gate array (FPGA), digital signal processing (DSP) and application-specific integrated circuit (ASIC) technology, architectural support for on-chip integration of custom accelerators with processors, and O/S support for these systems. Finally, it offers full details on architecture, testability, and computer-aided design (CAD) support for embedded systems, soft processors, heterogeneous resources, and on-chip storage before concluding with coverage of software support in particular, O/S Linux. Embedded Systems: Hardware, Design, and Implementation is an ideal book for design engineers looking to optimize and reduce the size and cost of embedded system products and increase their reliability and performance.
Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798
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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
