Robust Run-to-Run Control for Semiconductor Manufacturing with Static Process Models PDF Download
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Author: Sudhakar Adivikolanu
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages : 9
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Author: Sudhakar Adivikolanu
Publisher:
ISBN:
Category : Chemical engineering
Languages : en
Pages : 9
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Book Description
Author: James Moyne
Publisher: CRC Press
ISBN: 1420040669
Category : Technology & Engineering
Languages : en
Pages : 368
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Book Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 43
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Author: Chadi Elias El Chemali
Publisher:
ISBN:
Category :
Languages : en
Pages : 480
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Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 994
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Book Description
Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566770965
Category : Technology & Engineering
Languages : en
Pages : 644
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Author: Xiaojing Jiang
Publisher:
ISBN:
Category :
Languages : en
Pages : 250
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Book Description
Control performance assessment (CPA) is an important tool to realize high performance control systems in manufacturing plants. CPA of both continuous and batch processes have attracted much attention from researchers, but only a few results about semiconductor processes have been proposed previously. This work provides methods for performance assessment and diagnosis of the run-to-run control system used in high-mix semiconductor manufacturing processes. First, the output error source of the processes with a run-to-run EWMA controller is analyzed and a CPA method (namely CPA I) is proposed based on closed-loop parameter estimation. In CPA I, ARMAX regression is directly applied to the process output error, and the performance index is defined based on the variance of the regression results. The influence of plant model mismatch in the process gain and disturbance model parameter to the control performance in the cases with or without set point change is studied. CPA I method is applied to diagnose the plant model mismatch in the case with set point change. Second, an advanced CPA method (namely CPA II) is developed to assess the control performance degradation in the case without set point change. An estimated disturbance is generated by a filter, and ARMAX regression method is applied to the estimated disturbance to assess the control performance. The influence of plant model mismatch, improper controller tuning, metrology delay, and high-mix process parameters is studied and the results showed that CPA II method can quickly identify, diagnose and correct the control performance degradation. The CPA II method is applied to industrial data from a high-mix photolithography process in Texas Instruments and the influence of metrology delay and plant model mismatch is discussed. A control performance optimization (CPO) method based on analysis of estimated disturbance is proposed, and optimal EWMA controller tuning factor is suggested. Finally, the CPA II method is applied to non-threaded run-to-run controller which is developed based on state estimation and Kalman filter. Overall process control performance and state estimation behavior are assessed. The influence of plant model mismatch and improper selection of different controller variables is studied.
Author: Houmin Yan
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Book Description
A simulation model based on a real wafer fabrication is used to investigate the robustness of the two boundary (TB) production control strategy to the existing uniform loading policy used in a semiconductor fab. Our findings confirm that the TB policy is the most robust of all when random interference, such as machine breakdowns and demand variations, exist. It is also observed that the performance of the wafer fabrication facility under investigation can be improved significantly in terms of reducing cycle time, decreasing work-in-progress (WIP), and cutting down inventory cost.
Author: John Musacchio
Publisher:
ISBN:
Category :
Languages : en
Pages : 66
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Book Description
Author: 郭子瑋
Publisher:
ISBN:
Category :
Languages : en
Pages :
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