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Author: Aurélien Lecavelier des Etangs-Levallois
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0
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Book Description
Le développement de nombreuses applications nomades, souples, déformables et sur de larges surfaces nécessite la réalisation de circuits mécaniquement flexibles, intégrant des capacités d'interaction avec l'environnement, de communication et de traitement de signal. Une part importante de ces applications provient actuellement de l'industrie de l'électronique organique, ou intègre des films semiconducteurs à forte mobilité sur des substrats plastiques afin d'atteindre de meilleures performances. La combinaison de hautes performances électroniques (ondes millimétriques, faible bruit), et d'une bonne flexibilité mécanique avec la stabilité des propriétés électroniques lors de déformations représente un des grands défis de l'électronique future. Lors de ces travaux, une procédure d'amincissement puis de transfert sur un film plastique des composants CMOS initiallement réalisés conventionnellement sur des tranches SOI (silicium sur isolant) a été développée. Cette solution permet la réalisation de transistors MOS flexibles et performants : possédant des fréquences caractéristiques fT/fmax de 150/160GHz et des performances en bruit NFmin/Ga de 0.57/17.8dB. De plus, positionner le plan neutre de l'ensemble au niveau de la couche active du transistor permet de réduire les variations de propriétés électroniques à 5% même lors de déformations agressives. La réalisation de composants souples, performants et stable a ainsi été démontrée.
Author: Aurélien Lecavelier des Etangs-Levallois
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0
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Book Description
Le développement de nombreuses applications nomades, souples, déformables et sur de larges surfaces nécessite la réalisation de circuits mécaniquement flexibles, intégrant des capacités d'interaction avec l'environnement, de communication et de traitement de signal. Une part importante de ces applications provient actuellement de l'industrie de l'électronique organique, ou intègre des films semiconducteurs à forte mobilité sur des substrats plastiques afin d'atteindre de meilleures performances. La combinaison de hautes performances électroniques (ondes millimétriques, faible bruit), et d'une bonne flexibilité mécanique avec la stabilité des propriétés électroniques lors de déformations représente un des grands défis de l'électronique future. Lors de ces travaux, une procédure d'amincissement puis de transfert sur un film plastique des composants CMOS initiallement réalisés conventionnellement sur des tranches SOI (silicium sur isolant) a été développée. Cette solution permet la réalisation de transistors MOS flexibles et performants : possédant des fréquences caractéristiques fT/fmax de 150/160GHz et des performances en bruit NFmin/Ga de 0.57/17.8dB. De plus, positionner le plan neutre de l'ensemble au niveau de la couche active du transistor permet de réduire les variations de propriétés électroniques à 5% même lors de déformations agressives. La réalisation de composants souples, performants et stable a ainsi été démontrée.
Author: Chinmay K. Maiti
Publisher: CRC Press
ISBN: 1000638111
Category : Technology & Engineering
Languages : en
Pages : 314
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Book Description
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author: Sabri Janfaoui
Publisher:
ISBN:
Category :
Languages : fr
Pages : 152
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Book Description
Le travail de cette thèse consiste à transférer la technologie de fabrication du silicium microcristallin sur un substrat flexible et transparent. Cette technologie de fabrication est réalisée dans le laboratoire à une température
Author: Justine Philippe
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0
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Book Description
Le développement de nombreuses applications nomades, souples, déformables et sur de larges surfaces nécessite la réalisation de circuits mécaniquement flexibles, intégrant des capacités d'intéraction avec l'environnement, de communication et de traitement du signal. Une part importante de ces applications proviennent actuellement de l'industrie de l'électronique organique, mais l'apparition de nouvelles méthodes de fabrication a permis la réalisation de dispositifs à la fois souples mécaniquement et électriquement performants. En outre, les techniques de report sur substrat souple présentent de nombreux avantages (flexibilité mécanique, conservation des propriétés originelles, intégration hétérogène possible). Lors de ces travaux, une procédure d'amincissement puis de transfert sur film souple (métal, verre) des composants CMOS initialement réalisés sur des tranches SOI (silicium sur isolant) a été développée. Cette solution permet la réalisation de transistors MOS flexibles et performants possédant des fréquences caractéristiques fT/fmax de 165/188 GHz. De plus, l'utilisation d'autres matériaux que le plastique permet de modifier les propriétés originelles d'un dispositif en termes de dissipations thermiques ou de distorsions harmoniques par exemple, afin d'en améliorer les performances. La réalisation de composants souples, performants et stables a donc été démontrée.
Author: Gennady Gildenblat
Publisher: Springer Science & Business Media
ISBN: 9048186145
Category : Technology & Engineering
Languages : en
Pages : 531
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Book Description
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.
Author: J.-P. Colinge
Publisher: Springer Science & Business Media
ISBN: 9781402077739
Category : Science
Languages : en
Pages : 392
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Book Description
Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.
Author: Manoj Kumar Majumder
Publisher: CRC Press
ISBN: 1000223078
Category : Science
Languages : en
Pages : 373
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Book Description
Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.
Author: Preeti Ranjan Panda
Publisher: Springer Science & Business Media
ISBN: 144196388X
Category : Technology & Engineering
Languages : en
Pages : 260
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Book Description
The Information and communication technology (ICT) industry is said to account for 2% of the worldwide carbon emissions – a fraction that continues to grow with the relentless push for more and more sophisticated computing equipment, c- munications infrastructure, and mobile devices. While computers evolved in the directionofhigherandhigherperformanceformostofthelatterhalfofthe20thc- tury, the late 1990’s and early 2000’ssaw a new emergingfundamentalconcern that has begun to shape our day-to-day thinking in system design – power dissipation. As we elaborate in Chapter 1, a variety of factors colluded to raise power-ef?ciency as a ?rst class design concern in the designer’s mind, with profound consequences all over the ?eld: semiconductor process design, circuit design, design automation tools, system and application software, all the way to large data centers. Power-ef?cient System Design originated from a desire to capture and highlight the exciting developments in the rapidly evolving ?eld of power and energy op- mization in electronic and computer based systems. Tremendous progress has been made in the last two decades, and the topic continues to be a fascinating research area. To develop a clearer focus, we have concentrated on the relatively higher level of design abstraction that is loosely called the system level. In addition to the ext- sive coverage of traditional power reduction targets such as CPU and memory, the book is distinguished by detailed coverage of relatively modern power optimization ideas focussing on components such as compilers, operating systems, servers, data centers, and graphics processors.
Author: Yogeenth Kumaresan
Publisher: Cambridge University Press
ISBN: 1108899587
Category : Technology & Engineering
Languages : en
Pages : 124
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Book Description
Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.
Author: Dominik G. Rabus
Publisher: Springer
ISBN: 3540687882
Category : Science
Languages : en
Pages : 270
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Book Description
The optical filter is resonator based. The required passband shape of ring resonator-filters can be custom designed by the use of configurations of various ring coupled resonators. This book describes the current state-of-the-art on these devices. It provides an in-depth knowledge of the simulation, fabrication and characterization of ring resonators for use as example filters, lasers, sensors.
