Reliability Stress and Failure Rate Data for Electronic Equipment PDF Download
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Author: United States. Department of Defense
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 344
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Book Description
Author: United States. Department of Defense
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 344
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Electronics in military engineering
Languages : en
Pages : 328
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Book Description
Author: United States. Department of Defense
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 504
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 182
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Book Description
Author: Geoffrey W. A. Dummer
Publisher: Elsevier
ISBN: 1483149269
Category : Technology & Engineering
Languages : en
Pages : 249
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Book Description
Electronics Reliability–Calculation and Design provides an introduction to the fundamental concepts of reliability. The increasing complexity of electronic equipment has made problems in designing and manufacturing a reliable product more and more difficult. Specific techniques have been developed that enable designers to integrate reliability into their products, and reliability has become a science in its own right. The book begins with a discussion of basic mathematical and statistical concepts, including arithmetic mean, frequency distribution, median and mode, scatter or dispersion of measurements, and the normal and binomial distributions. Separate chapters deal with techniques for calculating equipment and system reliability; safety and derating factors; and the effects of constructional methods on reliability. Subsequent chapters cover environmental effects on reliability; improved reliability through microelectronics or integrated circuits; and failure rates for electronic components. Each chapter concludes with questions to enable students to test their understanding of the topics discussed. This book offers students an introduction to the subject of reliability in a form that is easily assimilated. It also serves as a reference to the various aspects contributing towards increased reliability of both electronic equipment and complete systems.
Author: United States. Advisory Group on Reliability of Electronic Equipment
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 608
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Book Description
Author: United States. Department of Defense
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 528
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Book Description
Author: T. R. Moss
Publisher: Professional Engineering Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 320
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Book Description
Component failure rate data are a vital part of any reliability or safety study and highly relevant to the engineering community across many disciplines. This book gives a comprehensive account of the subject.
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Radio Corporation of America. Defense Electronic Products
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 196
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Book Description
