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Author: Ning-Cheng Lee
Publisher: Elsevier
ISBN: 008049224X
Category : Technology & Engineering
Languages : en
Pages : 281
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: Ning-Cheng Lee
Publisher: Elsevier
ISBN: 008049224X
Category : Technology & Engineering
Languages : en
Pages : 281
Get Book Here
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: Howard H. Manko
Publisher: Springer Science & Business Media
ISBN: 9780442012069
Category : Computers
Languages : en
Pages : 548
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Book Description
Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Author: Michael Pecht
Publisher: John Wiley & Sons
ISBN: 9780471591672
Category : Technology & Engineering
Languages : en
Pages : 316
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Book Description
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.
Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: R. Sengupta
Publisher: New Age International
ISBN: 9788122411096
Category :
Languages : en
Pages : 122
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Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Author: Darrel R. Frear
Publisher: Springer Science & Business Media
ISBN: 9780442015053
Category : Computers
Languages : en
Pages : 434
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Book Description
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Author: Balázs Illés
Publisher: Elsevier
ISBN: 0128185066
Category : Technology & Engineering
Languages : en
Pages : 295
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Book Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles - Analyses and compares the different reflow ovens - Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality - Introduces Vapor Phase Soldering (VPS) technology
Author: Dongkai Shangguan
Publisher: ASM International
ISBN: 161503093X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
Author: Jasbir Bath
Publisher: Springer Science & Business Media
ISBN: 0387684220
Category : Technology & Engineering
Languages : en
Pages : 307
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Book Description
The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Author: Karl J. Puttlitz
Publisher: CRC Press
ISBN: 082475249X
Category : Technology & Engineering
Languages : en
Pages : 1044
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Book Description
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
