Qpedia Thermal Management – Electronics Cooling Book, Volume 3 PDF Download
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Author: Advanced Thermal Solutions
Publisher: Advanced Thermal Solutions
ISBN: 098462791X
Category : Science
Languages : en
Pages : 204
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Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Author: Advanced Thermal Solutions
Publisher: Advanced Thermal Solutions
ISBN: 098462791X
Category : Science
Languages : en
Pages : 204
Get Book Here
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Author:
Publisher: Advanced Thermal Solutions
ISBN: 061523660X
Category :
Languages : en
Pages : 186
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Book Description
Author: Advanced Thermal Solutions
Publisher: Advanced Thermal Solutions
ISBN: 0984627901
Category : Science
Languages : en
Pages : 206
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Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Author: S. M. Sohel Murshed
Publisher: BoD – Books on Demand
ISBN: 9535124056
Category : Computers
Languages : en
Pages : 184
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Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9814579807
Category : Technology & Engineering
Languages : en
Pages : 471
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Book Description
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Author: Sadik Kakaç
Publisher: Springer Science & Business Media
ISBN: 9401110905
Category : Technology & Engineering
Languages : en
Pages : 953
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Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Kannan Govindan
Publisher: Springer Nature
ISBN: 9811627940
Category : Technology & Engineering
Languages : en
Pages : 1422
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Book Description
This book presents select papers from the International Conference on Energy, Material Sciences and Mechanical Engineering (EMSME) - 2020. The book covers the three core areas of energy, material sciences and mechanical engineering. The topics covered include non-conventional energy resources, energy harvesting, polymers, composites, 2D materials, systems engineering, materials engineering, micro-machining, renewable energy, industrial engineering and additive manufacturing. This book will be useful to researchers and professionals working in the areas of mechanical and industrial engineering, materials applications, and energy technology.
Author: Sung Jin Kim
Publisher: CRC Press
ISBN: 1000151743
Category : Technology & Engineering
Languages : en
Pages : 264
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Book Description
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Author: Frank P. Incropera
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.
Author: Kaveh Azar
Publisher: CRC Press
ISBN: 1000102769
Category : Technology & Engineering
Languages : en
Pages : 496
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Book Description
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
