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Author: Wolfgang E. G. Hansal
Publisher:
ISBN: 9783874802659
Category : Plating
Languages : en
Pages : 385
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Book Description
Author: Wolfgang E. G. Hansal
Publisher:
ISBN: 9783874802659
Category : Plating
Languages : en
Pages : 385
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Book Description
Author: J. K. Dennis
Publisher: Butterworth-Heinemann
ISBN: 1483163407
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
Nickel and Chromium Plating, Second Edition, does not merely update the first edition but also places additional emphasis on certain methods that have achieved increased industrial use in the 14 years since the first edition was published. The book begins by tracing the history of nickel and chromium plating. This is followed by a discussion of the electrochemistry of electrodeposition from aqueous electrolyte solutions. Separate chapters cover topics such as autocatalytic (electroless) nickel deposition; nickel plating onto aluminum and other difficult substrates; plating onto plastics and high-speed plating; the deposition of various nickel alloys for decorative and functional applications; composite coatings; and tampon (brush) plating. This book will be helpful to those new to the plating industry; those experienced in the industry will find that this revised version enables them to keep up-to-date with the latest developments in this specialized technology.
Author: Mordechay Schlesinger
Publisher: John Wiley & Sons
ISBN: 0470167785
Category : Science
Languages : en
Pages : 755
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Book Description
The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Author: Nasser Kanani
Publisher: Elsevier
ISBN: 0080505392
Category : Technology & Engineering
Languages : en
Pages : 367
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Book Description
Electroplating: Basic Principles, Processes and Practice offers an understanding of the theoretical background to electroplating, which is essential if the practical results are to be as required. This book is different in that it explains HOW the electrodeposition processes work, covering such topics as the elctrodeposition of composites, multilayers, whisker formation and giant magnetoresistive effects. The section on R & D approaches will be especially useful for organisations in the field. This is the first English language version of a well-known German language book from a prestigious author of international repute.'Electroplating' is an invaluable resource for manufacturers of coatings, electrochemists, metal finishers and their customers and academics in surface engineering.·Offers an understanding of the theoretical background to electroplating·Explains how the electrodeposition processes work·Prestigious author of international repute
Author: S. R. Brankovic
Publisher: The Electrochemical Society
ISBN: 1566778085
Category : Science
Languages : en
Pages : 115
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Book Description
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Fundamentals of Electrochemical Growth: From UPD to Microstructures ¿ Symposium in Memory of Prof. Evgeni Budevski¿, held during the 216th meeting of The Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009.
Author: Tetsuya Osaka
Publisher: CRC Press
ISBN: 9789056990022
Category : Science
Languages : en
Pages : 658
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Book Description
The electronics industry underwent a rapid evolution from thick to thin films during the last decade. Electrochemical technology played an important and often decisive role in the direction of this evolution. Applications include plating through mask technology, plating for thin film heads, plating for high density magnetic thin film, selective etching technology, etc. New electrochemical approaches have also been developed which will play key roles in the electronics industry. This book reports on the latest progress in electrochemical processes, including fundamentals and applications. Additional volumes dealing with more specific applications of electrochemistry are also planned.
Author: Lubomyr Taras Romankiw
Publisher: The Electrochemical Society
ISBN: 9781566772570
Category : Science
Languages : en
Pages : 452
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Book Description
The symposium was jointly held by the US and Japanese societies, but drew participants from companies, universities, and research institutes in 12 countries. The 47 papers cover high density packaging and related technologies, electronic devices and related materials and processes, micro-electromechanical systems and microfabrication, magnetic materials and devices, and fundamental studies on the materials for electrochemical technology applications. Nearly half of them, 23, were invited. Annotation copyrighted by Book News Inc., Portland, OR.
Author: Yosi Shacham-Diamand
Publisher: Springer Science & Business Media
ISBN: 0387958681
Category : Science
Languages : en
Pages : 545
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Book Description
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author:
Publisher:
ISBN:
Category : Mineral industries
Languages : en
Pages : 608
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Book Description
Author: U. Kamachi Mudali
Publisher: Springer Nature
ISBN: 9811675546
Category : Technology & Engineering
Languages : en
Pages : 241
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Book Description
This book encompasses select proceedings of NSEST-2020 and ECSIRM-2020. The volume covers advances in major areas of electrochemical science and technology and surface engineering. It covers all aspects of electrochemistry with more emphasis on corrosion. The corrosion topics include self-healing sol-gel based corrosion resistant coatings, nitric acid corrosion of stainless steel, stress corrosion cracking, etc. Few chapters are focused on electrodeposition and new materials for oxygen evolution catalysts, fuel cells and batteries. The chapters on molecularly imprinted polymer sensor for dual analytes, electrochemical sensors for lead ions and dopamine, etc., are of interest. Some papers are related to the green synthesis of nanosized oxides and superhydrophobic coatings. This book will be handy and beneficial to researchers, students, and professionals working in areas related to electrochemistry and surface engineering.
