Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 PDF Download
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Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686201
Category : Science
Languages : en
Pages : 140
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Book Description
Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686201
Category : Science
Languages : en
Pages : 140
Get Book Here
Book Description
Author: K. Kondo
Publisher: The Electrochemical Society
ISBN: 1607686716
Category :
Languages : en
Pages : 119
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Book Description
Author: J. C. Flake
Publisher: The Electrochemical Society
ISBN: 1566778123
Category : Science
Languages : en
Pages : 171
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Book Description
This issue focuses on recent advances in damascene interconnects and 3D interconnects.
Author: K. Kondi
Publisher:
ISBN: 9781623323134
Category :
Languages : en
Pages :
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Book Description
Author: Chuan Seng Tan
Publisher: Springer Science & Business Media
ISBN: 0387765344
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566773935
Category : Technology & Engineering
Languages : en
Pages : 438
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Book Description
Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527644237
Category : Technology & Engineering
Languages : en
Pages : 435
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Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774178
Category : Dielectrics
Languages : en
Pages : 508
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Book Description
Author:
Publisher: The Electrochemical Society
ISBN: 9781566774024
Category : Technology & Engineering
Languages : en
Pages : 408
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Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 1566775728
Category : Integrated circuits
Languages : en
Pages : 509
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Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
