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Author: P.R. von Rohr
Publisher: Elsevier
ISBN: 0080533957
Category : Technology & Engineering
Languages : en
Pages : 728
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Book Description
This present volume contains the text of all contributions (oral and posters), except for the four invited papers, which were presented at the 3rd International Symposium on High Pressure Chemical Engineering on October 7-9, 1996. The symposium was divided into three major sections, namely- Chemical reaction engineering- Separation processes and phase equilibria- Plant, apparatus, machinery, measurements, control.
Author: P.R. von Rohr
Publisher: Elsevier
ISBN: 0080533957
Category : Technology & Engineering
Languages : en
Pages : 728
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Book Description
This present volume contains the text of all contributions (oral and posters), except for the four invited papers, which were presented at the 3rd International Symposium on High Pressure Chemical Engineering on October 7-9, 1996. The symposium was divided into three major sections, namely- Chemical reaction engineering- Separation processes and phase equilibria- Plant, apparatus, machinery, measurements, control.
Author: Muhammad Abbas Ahmad Zaini
Publisher: Springer Nature
ISBN: 9811607427
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
This book contains papers presented in the 3rd International Conference on Separation Technology 2020 (ICoST 2020) held from 15 to 16th August 2020 at Johor, Malaysia. This proceeding contains papers presented by academics and industrial practitioners showcasing the latest advancements and findings in field of separation technology. The papers are categorized under the following tracks and topics of research: Environment Engineering Biotechnology Absorption and Adsorption Technology Wastewater Treatment ICoST 2020 covers multidisciplinary perspectives on separation research and aims to promote scientific information interchange between academics, researchers, graduates and industry professionals worldwide. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
Author: P. F. McGoldrick
Publisher:
ISBN: 9781475713565
Category :
Languages : en
Pages : 508
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Book Description
Author: Seymour Katz
Publisher: Springer Science & Business Media
ISBN: 146131013X
Category : Technology & Engineering
Languages : en
Pages : 527
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Book Description
For a number of years it has been a General Motors Research Laboratories custom to hold a symposium on a subject which is new and emerging, and to invite the best people in the world in that subject to come together to talk to each other. Initially, I had some difficulty in regarding foundry processes as a new and emerging subject. Copper alloys have been in foundry practice for about six thousand years. Foundrymen working with those alloys have been recognized, as such, for nearly all that time. Iron has a much shorter history, probably only three or four thousand years. So what's new? What is new is that a subject which has always been so complex and so difficult that it could only be a craft skill, with bits and pieces of knowledge and bits and pieces of insight, has begun to yield to new abilities to solve very complex problems. We do this now because we can handle great amounts of data by computational means, using new and more complicated theoretical treatments than we could deal with before. In fact, we have a new technology with which we can attack these terribly difficult problems. Thus, foundry processing is becoming a new subject because new things can be done with it.
Author: Mihail Ionescu
Publisher: Trans Tech Publications Ltd
ISBN: 3035736308
Category : Medical
Languages : en
Pages : 1937
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Book Description
International Conference on Processing & Manufacturing of Advanced Materials Processing, Fabrication, Properties, Applications Selected, peer-reviewed papers from the International Conference on Processing & Manufacturing of Advanced Materials Processing, Fabrication, Properties, Applications (THERMEC 2021), May 10-14, 2021, Vienna, Austria
Author: Y N Zhou
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835
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Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 1044
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Book Description
Author: Yogeshwar Sahai (Ph. D.)
Publisher: World Scientific
ISBN: 9812706216
Category : Technology & Engineering
Languages : en
Pages : 329
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Book Description
Continuous casting of steel has become a widely used process and an important step in steel production. The worldwide share of continuously cast steel has increased significantly in the last 25 years or so. However, concurrent with this increase in production levels are stringent quality requirements that have become crucial in the face of progressively increasing machine throughputs and larger product dimensions. As a result, steel cleanliness and strict composition control are now the primary concern of steelmakers.The tundish is the last metallurgical vessel through which molten metal flows before solidifying in the continuous casting mold. During the transfer of metal through the tundish, molten steel interacts with refractories, slag, and the atmosphere. Thus, the proper design and operation of a tundish are important for delivering steel of strict composition and quality. This pioneering book is the first of its kind to cover all aspects of tundish technology, ranging from fundamental aspects and theory necessary for understanding the basic concepts of tundish operations to operational aspects of the tundish. Written by internationally recognized experts in continuous casting technology in general and tundish technology in particular, this book is sufficiently fundamental to serve as a graduate-level textbook on process metallurgy or as an important reference for metallurgical researchers; at the same time, it is comprehensive enough to contribute to the understanding of scientists and engineers engaged in research and development in the steel industry.
Author: Chuan Seng Tan
Publisher: Springer Science & Business Media
ISBN: 0387765344
Category : Technology & Engineering
Languages : en
Pages : 365
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Book Description
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Author:
Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1944
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Book Description
A union list of serials commencing publication after Dec. 31, 1949.
