Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications PDF Download
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Author: John R. Susko
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 228
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Book Description
Author: John R. Susko
Publisher:
ISBN:
Category : Electrochemistry
Languages : en
Pages : 228
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Book Description
Author: John H. Lupinski
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 520
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Book Description
From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Sulaiman Khalifeh
Publisher: Elsevier
ISBN: 192788568X
Category : Technology & Engineering
Languages : en
Pages : 617
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Book Description
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Author:
Publisher:
ISBN:
Category : Avionics
Languages : en
Pages : 728
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 978
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Book Description
Author: Wen Shyang Chow
Publisher: Springer Nature
ISBN: 9819920159
Category : Technology & Engineering
Languages : en
Pages : 363
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Book Description
This book presents the selected papers from the 19th Asian Workshop in Polymer Processing (AWPP 2022) highlighting the latest research breakthroughs in the field of polymeric materials and processing technologies. The topics of the conference provides an exclusive forum for intellectually stimulating and engaging interactions among academicians and industrialists to share their recent scientific breakthroughs and emerging trends in polymer processing technologies and their contributions towards environmental sustainability. Its content appeals to the researchers, academics, industry practitioners working in the field of green sustainable polymers.
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 0387473262
Category : Technology & Engineering
Languages : en
Pages : 553
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Moumita Mukherjee
Publisher: BoD – Books on Demand
ISBN: 9533079681
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
Silicon Carbide (SiC) and its polytypes, used primarily for grinding and high temperature ceramics, have been a part of human civilization for a long time. The inherent ability of SiC devices to operate with higher efficiency and lower environmental footprint than silicon-based devices at high temperatures and under high voltages pushes SiC on the verge of becoming the material of choice for high power electronics and optoelectronics. What is more important, SiC is emerging to become a template for graphene fabrication, and a material for the next generation of sub-32nm semiconductor devices. It is thus increasingly clear that SiC electronic systems will dominate the new energy and transport technologies of the 21st century. In 21 chapters of the book, special emphasis has been placed on the materials aspects and developments thereof. To that end, about 70% of the book addresses the theory, crystal growth, defects, surface and interface properties, characterization, and processing issues pertaining to SiC. The remaining 30% of the book covers the electronic device aspects of this material. Overall, this book will be valuable as a reference for SiC researchers for a few years to come. This book prestigiously covers our current understanding of SiC as a semiconductor material in electronics. The primary target for the book includes students, researchers, material and chemical engineers, semiconductor manufacturers and professionals who are interested in silicon carbide and its continuing progression.
Author: J.H. Lai
Publisher: CRC Press
ISBN: 1351092804
Category : Mathematics
Languages : en
Pages : 387
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Book Description
The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.
Author: Clemens J.M. Lasance
Publisher: Springer Science & Business Media
ISBN: 1461450918
Category : Technology & Engineering
Languages : en
Pages : 550
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Book Description
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
