Author: James R. Lloyd
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description
Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
Author: James R. Lloyd
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 214
Book Description
The Chemistry of Metal CVD
Author: Toivo T. Kodas
Publisher: John Wiley & Sons
ISBN: 3527615849
Category : Technology & Engineering
Languages : en
Pages : 562
Book Description
High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Publisher: John Wiley & Sons
ISBN: 3527615849
Category : Technology & Engineering
Languages : en
Pages : 562
Book Description
High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
Mechanics and Materials for Electronic Packaging: Design and process issues in electronic packaging
Author: American Society of Mechanical Engineers. Applied Mechanics Division
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 244
Book Description
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 244
Book Description
IBM Journal of Research and Development
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 550
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 550
Book Description
Advanced Metallization Conference in ...
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 806
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 806
Book Description
Proceedings of the Ninth International Vacuum Congress and Fifth International Conference on Solid Surfaces: Invited speakers' volume
Author: J. L. de Segovia
Publisher:
ISBN:
Category : Fusion reactors
Languages : en
Pages : 752
Book Description
Publisher:
ISBN:
Category : Fusion reactors
Languages : en
Pages : 752
Book Description
Proceedings .... International IEEE VLSI Multilevel Interconnection Conference
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 518
Book Description
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 518
Book Description
Electrical & Electronics Abstracts
Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
1986 Proceedings
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 544
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 544
Book Description
Index to IEEE Publications
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 870
Book Description
Issues for 1973- cover the entire IEEE technical literature.
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 870
Book Description
Issues for 1973- cover the entire IEEE technical literature.