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Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 326
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Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 326
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Book Description
Author: Vaughn E. Akins
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 302
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Book Description
Author: Joseph B. Anthony
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 512
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Book Description
Author:
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 832
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Book Description
Author: Franz Fasching
Publisher: Springer Science & Business Media
ISBN: 370919315X
Category : Computers
Languages : en
Pages : 313
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Book Description
As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: James E. Morris
Publisher: Springer Science & Business Media
ISBN: 9400904398
Category : Technology & Engineering
Languages : en
Pages : 459
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Book Description
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author: Luciano Lavagno
Publisher: CRC Press
ISBN: 1351830996
Category : Technology & Engineering
Languages : en
Pages : 773
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Book Description
The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Author: Swarup Bhunia
Publisher: Morgan Kaufmann
ISBN: 0128124784
Category : Computers
Languages : en
Pages : 528
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Book Description
Hardware Security: A Hands-On Learning Approach provides a broad, comprehensive and practical overview of hardware security that encompasses all levels of the electronic hardware infrastructure. It covers basic concepts like advanced attack techniques and countermeasures that are illustrated through theory, case studies and well-designed, hands-on laboratory exercises for each key concept. The book is ideal as a textbook for upper-level undergraduate students studying computer engineering, computer science, electrical engineering, and biomedical engineering, but is also a handy reference for graduate students, researchers and industry professionals. For academic courses, the book contains a robust suite of teaching ancillaries. Users will be able to access schematic, layout and design files for a printed circuit board for hardware hacking (i.e. the HaHa board) that can be used by instructors to fabricate boards, a suite of videos that demonstrate different hardware vulnerabilities, hardware attacks and countermeasures, and a detailed description and user manual for companion materials. - Provides a thorough overview of computer hardware, including the fundamentals of computer systems and the implications of security risks - Includes discussion of the liability, safety and privacy implications of hardware and software security and interaction - Gives insights on a wide range of security, trust issues and emerging attacks and protection mechanisms in the electronic hardware lifecycle, from design, fabrication, test, and distribution, straight through to supply chain and deployment in the field - A full range of instructor and student support materials can be found on the authors' own website for the book: http://hwsecuritybook.org
