Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 290
Book Description
Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I
Author: Electrochemical Society. Dielectric Science and Technology Division
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 290
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 290
Book Description
Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition II
Author: Panayotis C. Andricacos
Publisher: The Electrochemical Society
ISBN: 9781566772310
Category : Science
Languages : en
Pages : 418
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772310
Category : Science
Languages : en
Pages : 418
Book Description
Electrochemical Processing in ULSI Fabrication III
Author: Panayotis C. Andricacos
Publisher: The Electrochemical Society
ISBN: 9781566772730
Category : Computers
Languages : en
Pages : 262
Book Description
"Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Publisher: The Electrochemical Society
ISBN: 9781566772730
Category : Computers
Languages : en
Pages : 262
Book Description
"Held May 2000 in Toronto, Canada, as part of the 197th meeting of the Electrochemical Society."--Pref.
Morphological Evolution of Electrodeposits and Electrochemical Processing in ULSI Fabrication and Electrodeposition of and on Semiconductors IV
Author: Kazuo Kondo
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
Publisher: The Electrochemical Society
ISBN:
Category : Copper plating
Languages : en
Pages : 422
Book Description
Papers in this volume are from the 199th ECS Meeting, held in Washington, DC, Spring 2001. Morphology evolution encompasses electrochemical processing in ULSI fabrication, shape evolution, growth habit, and microstructure of electrodeposits. The most prominent example at present is the electrochemical deposition of copper for ULSI interconnects. Many other electrochemical processes at various stages of emergence and development hold promise for the electronics industry and beyond.
ULSI Process Integration III
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773768
Category : Technology & Engineering
Languages : en
Pages : 620
Book Description
ULSI Process Integration II
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566773089
Category : Technology & Engineering
Languages : en
Pages : 636
Book Description
Interconnect and Contact Metallization for ULSI
Author: G. S. Mathad
Publisher: The Electrochemical Society
ISBN: 9781566772549
Category : Science
Languages : en
Pages : 358
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772549
Category : Science
Languages : en
Pages : 358
Book Description
Electrochemical Processing in ULSI Fabrication and Semiconductor/metal Deposition
Author:
Publisher:
ISBN: 9781566772310
Category :
Languages : en
Pages : 0
Book Description
Publisher:
ISBN: 9781566772310
Category :
Languages : en
Pages : 0
Book Description
Electrochemical Processing in ULSI and MEMS 3
Author: John O. Dukovic
Publisher: The Electrochemical Society
ISBN: 1566775868
Category : Science
Languages : en
Pages : 288
Book Description
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Publisher: The Electrochemical Society
ISBN: 1566775868
Category : Science
Languages : en
Pages : 288
Book Description
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Proceedings of the Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling
Author: Milan Paunovic
Publisher: The Electrochemical Society
ISBN: 9781566771801
Category : Science
Languages : en
Pages : 666
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566771801
Category : Science
Languages : en
Pages : 666
Book Description