Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding PDF Download
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Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636
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Book Description
Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524
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Book Description
Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498
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Book Description
Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Author: M. Meyyappan
Publisher: The Electrochemical Society
ISBN: 9781566771368
Category : Technology & Engineering
Languages : en
Pages : 366
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Book Description
Author: H. Baumgart
Publisher: The Electrochemical Society
ISBN: 9781566773607
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566771566
Category : Science
Languages : en
Pages : 606
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Book Description
Author: Richard E. Novak
Publisher: The Electrochemical Society
ISBN: 9781566771153
Category : Technology & Engineering
Languages : en
Pages : 642
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Book Description
Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 827
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Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Author: G. R. Srinivasan
Publisher: The Electrochemical Society
ISBN: 9781566771542
Category : Science
Languages : en
Pages : 546
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Book Description
