Proceedings of the ... European Conference on Chemical Vapor Deposition PDF Download
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Author:
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 594
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Book Description
Author:
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 594
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Book Description
Author: Electrochemical Society. High Temperature Materials Division
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1296
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Book Description
Author:
Publisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 860
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Book Description
Author: Theodore M. Besmann
Publisher: The Electrochemical Society
ISBN: 9781566771559
Category : Science
Languages : en
Pages : 922
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Book Description
Author: Anjana Devi
Publisher: The Electrochemical Society
ISBN: 9781566774277
Category : Technology & Engineering
Languages : en
Pages : 1128
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Book Description
Author: John B. Wachtman
Publisher: John Wiley & Sons
ISBN: 0470315881
Category : Technology & Engineering
Languages : en
Pages : 682
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Book Description
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Author: Hugh O. Pierson
Publisher: William Andrew
ISBN: 0815517432
Category : Technology & Engineering
Languages : en
Pages : 507
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Book Description
Turn to this new second edition for an understanding of the latest advances in the chemical vapor deposition (CVD) process. CVD technology has recently grown at a rapid rate, and the number and scope of its applications and their impact on the market have increased considerably. The market is now estimated to be at least double that of a mere seven years ago when the first edition of this book was published. The second edition is an update with a considerably expanded and revised scope. Plasma CVD and metallo-organic CVD are two major factors in this rapid growth. Readers will find the latest data on both processes in this volume. Likewise, the book explains the growing importance of CVD in production of semiconductor and related applications.
Author: American Chemical Society. Chemical Abstracts Service
Publisher:
ISBN:
Category : Chemistry
Languages : en
Pages : 2064
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Book Description
A key source to journal and conference abbreviations in the sciences. Although it focuses on chemistry, other scientific and engineering disciplines are also well represented. In addition to the abbreviation and full title, each entry also contains publishing info, title changes, language and frequency of publication, and libraries owning that title. Over 130,000 entries representing more than 70,000 publications dating back to 1907 are included.
Author:
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 672
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Book Description
Author: Werner Kern
Publisher: Elsevier
ISBN: 0080524214
Category : Technology & Engineering
Languages : en
Pages : 881
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Book Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
