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Author: National Symposium on Reliability and Quality Control
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 636
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Book Description
Author: G. O. Hawley
Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 12
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Book Description
Author: Institute of Radio Engineers
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 1206
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Book Description
Author: United States. Office of the Assistant Secretary of Defense (Installations and Logistics)
Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 66
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 736
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Book Description
Author: University of California, Berkeley
Publisher:
ISBN:
Category : Catalogs
Languages : en
Pages : 34
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 586
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Book Description
Author: International Council of the Aeronautical Sciences. Congress
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1162
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Book Description
Author:
Publisher:
ISBN:
Category : Radio
Languages : en
Pages : 986
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Book Description
Author: Library of Congress. Copyright Office
Publisher: Copyright Office, Library of Congress
ISBN:
Category : Copyright
Languages : en
Pages : 1282
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Book Description
Includes Part 1, Number 1: Books and Pamphlets, Including Serials and Contributions to Periodicals (January - June)
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
