Proceedings PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Proceedings PDF full book. Access full book title Proceedings by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 404
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 404
Get Book Here
Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 696
Get Book Here
Book Description
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Get Book Here
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
Get Book Here
Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author: Charles E. Free
Publisher: John Wiley & Sons
ISBN: 1119114667
Category : Technology & Engineering
Languages : en
Pages : 532
Get Book Here
Book Description
RF and Microwave Circuit Design Provides up-to-date coverage of the fundamentals of high-frequency microwave technology, written by two leading voices in the field RF and Microwave Circuit Design: Theory and Applications is an authoritative, highly practical introduction to basic RF and microwave circuits. With an emphasis on real-world examples, the text explains how distributed circuits using microstrip and other planar transmission lines can be designed and fabricated for use in modern high-frequency passive and active circuits and sub-systems. The authors provide clear and accurate guidance on each essential aspect of circuit design, from the theory of transmission lines to the passive and active circuits that form the basis of modern high-frequency circuits and sub-systems. Assuming a basic grasp of electronic concepts, the book is organized around first principles and includes an extensive set of worked examples to guide student readers with no prior grounding in the subject of high-frequency microwave technology. Throughout the text, detailed coverage of practical design using distributed circuits demonstrates the influence of modern fabrication processes. Filling a significant gap in literature by addressing RF and microwave circuit design with a central theme of planar distributed circuits, this textbook: Provides comprehensive discussion of the foundational concepts of RF and microwave transmission lines introduced through an exploration of wave propagation along a typical transmission line Describes fabrication processes for RF and microwave circuits, including etched, thick-film, and thin-film RF circuits Covers the Smith Chart and its application in circuit design, S-parameters, Mason???s non-touching loop rule, transducer power gain, and stability Discusses the influence of noise in high-frequency circuits and low-noise amplifier design Features an introduction to the design of high-frequency planar antennas Contains supporting chapters on fabrication, circuit parameters, and measurements Includes access to a companion website with PowerPoint slides for instructors, as well as supplementary resources Perfect for senior undergraduate students and first-year graduate students in electrical engineering courses, RF and Microwave Circuit Design: Theory and Applications will also earn a place in the libraries of RF and microwave professionals looking for a useful reference to refresh their understanding of fundamental concepts in the field.
Author: Laurent A. Francis
Publisher: CRC Press
ISBN: 1351832077
Category : Technology & Engineering
Languages : en
Pages : 637
Get Book Here
Book Description
Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.
Author: John H. Lau
Publisher: Springer Nature
ISBN: 9819721407
Category :
Languages : en
Pages : 515
Get Book Here
Book Description
Author: Mel Schwartz
Publisher: CRC Press
ISBN: 1420043730
Category : Technology & Engineering
Languages : en
Pages : 556
Get Book Here
Book Description
Explores State-of-the-Art Work from the World's Foremost Scientists, Engineers, Educators, and Practitioners in the FieldWhy use smart materials?Since most smart materials do not add mass, engineers can endow structures with built-in responses to a myriad of contingencies. In their various forms, these materials can adapt to their environments by c
Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
Get Book Here
Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: J.-P. Colinge
Publisher: Springer Science & Business Media
ISBN: 1441991069
Category : Technology & Engineering
Languages : en
Pages : 375
Get Book Here
Book Description
Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.
