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Author: Titu I. Băjenescu
Publisher:
ISBN: 9782225699603
Category : Electronic apparatus and appliances
Languages : fr
Pages : 240
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Book Description
Author: Titu I. Băjenescu
Publisher:
ISBN: 9782225699603
Category : Electronic apparatus and appliances
Languages : fr
Pages : 240
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Book Description
Author: Titu I. Bajenescu
Publisher: Springer Science & Business Media
ISBN: 3642585051
Category : Technology & Engineering
Languages : en
Pages : 547
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Book Description
This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.
Author: Titu I. Băjenescu
Publisher: Artech House
ISBN: 1596934360
Category : Technology & Engineering
Languages : en
Pages : 706
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Book Description
The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
Author: Marius Bazu
Publisher: John Wiley & Sons
ISBN: 1119990009
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Author: Titu I. Bajenesco
Publisher:
ISBN:
Category :
Languages : fr
Pages :
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Book Description
Author: Abdulkerim Gok
Publisher: BoD – Books on Demand
ISBN: 1789848229
Category : Technology & Engineering
Languages : en
Pages : 171
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Book Description
Photovoltaic (PV) solar energy is expected to be the world's largest source of electricity in the future. To enhance the long-term reliability of PV modules, a thorough understanding of failure mechanisms is of vital importance. In addition, it is important to address the potential downsides to this technology. These include the hazardous chemicals needed for manufacturing solar cells, especially for thin-film technologies, and the large number of PV modules disposed of at the end of their lifecycles. This book discusses the reliability and environmental aspects of PV modules.
Author: Library of Congress
Publisher:
ISBN:
Category :
Languages : en
Pages : 1032
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Book Description
Author:
Publisher:
ISBN:
Category : Telecommunication
Languages : en
Pages : 766
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Book Description
Author: Safa Mbarek
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0
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Book Description
L'amélioration des systèmes de conversion d'énergie rend les dispositifs à base de SiC très attractifs pour leur efficacité, compacité et robustesse. Cependant, leur comportement en réponse à un défaut de court-circuit doit être soigneusement étudié pour assurer la fiabilité des systèmes. Ce travail de recherche porte sur les problèmes de robustesse et de fiabilité du MOSFET SiC sous contraintes de court-circuit. Cette étude repose sur des caractérisations électriques et microstructurales. La somme de toutes les caractérisations avant, pendant et après les tests de robustesse ainsi que l'analyse microstructurale permet de définir des hypothèses sur l'origine physique de la défaillance pour ce type de composants. De plus, la mesure de la capacité est introduite au cours des tests de vieillissement en tant qu'indicateur de santé et outil clé pour remonter à l'origine physique du défaut.
Author: New York Public Library. Research Libraries
Publisher:
ISBN:
Category : Classified catalogs (Universal decimal)
Languages : en
Pages : 568
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Book Description
