Printed Flexible Circuit: Introduction to Water-Repellent Polymer Substrate (UTeM Press) PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Printed Flexible Circuit: Introduction to Water-Repellent Polymer Substrate (UTeM Press) PDF full book. Access full book title Printed Flexible Circuit: Introduction to Water-Repellent Polymer Substrate (UTeM Press) by Ghazali Omar. Download full books in PDF and EPUB format.
Author: Ghazali Omar
Publisher: PENERBIT UTeM
ISBN: 9672792018
Category : Science
Languages : en
Pages : 114
Get Book Here
Book Description
PRINTED FLEXIBLE CIRCUIT Introduction to WaterÂRepellent Polymer Substrate Electronic industries are continually striving towards the use of flexibility and stretchability substrates like polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with good water repellent characteristics or also known as hydrophobicity to improve the functionality of printed circuit for electronic packaging. This book focuses on the hydrophobicity performance of flexible substrate PET and TPU with the presence and absence of ceramic coating (Ti02). A low-cost self-fabricated contact angle measurement tool is also invented to fulfill the hydrophobicity analysis by using the Process Design and Development (PDD) concept involving the Pugh Method followed by a One-Sample T-Test to verify the accuracy measurement of the selected design. The knowledge gained would be beneficial to extend the use of flexible substrate PET and TPU and Ti02 coating in electronic applications
Author: Ghazali Omar
Publisher: PENERBIT UTeM
ISBN: 9672792018
Category : Science
Languages : en
Pages : 114
Get Book Here
Book Description
PRINTED FLEXIBLE CIRCUIT Introduction to WaterÂRepellent Polymer Substrate Electronic industries are continually striving towards the use of flexibility and stretchability substrates like polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with good water repellent characteristics or also known as hydrophobicity to improve the functionality of printed circuit for electronic packaging. This book focuses on the hydrophobicity performance of flexible substrate PET and TPU with the presence and absence of ceramic coating (Ti02). A low-cost self-fabricated contact angle measurement tool is also invented to fulfill the hydrophobicity analysis by using the Process Design and Development (PDD) concept involving the Pugh Method followed by a One-Sample T-Test to verify the accuracy measurement of the selected design. The knowledge gained would be beneficial to extend the use of flexible substrate PET and TPU and Ti02 coating in electronic applications
Author: American Public Health Association
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 1254
Get Book Here
Book Description
Author: Harold F. Giles Jr
Publisher: William Andrew
ISBN: 1437734820
Category : Technology & Engineering
Languages : en
Pages : 638
Get Book Here
Book Description
The second edition of Extrusion is designed to aid operators, engineers, and managers in extrusion processing in quickly answering practical day-to-day questions. The first part of the book provides the fundamental principles, for operators and engineers, of polymeric materials extrusion processing in single and twin screw extruders. The next section covers advanced topics including troubleshooting, auxiliary equipment, and coextrusion for operators, engineers, and managers. The final part provides applications case studies in key areas for engineers such as compounding, blown film, extrusion blow molding, coating, foam, and reprocessing. This practical guide to extrusion brings together both equipment and materials processing aspects. It covers basic and advanced topics, for reference and training, in thermoplastics processing in the extruder. Detailed reference data are provided on such important operating conditions as temperatures, start-up procedures, shear rates, pressure drops, and safety. A practical guide to the selection, design and optimization of extrusion processes and equipment Designed to improve production efficiency and product quality Focuses on practical fault analysis and troubleshooting techniques
Author: Arthur A. Tracton
Publisher: CRC Press
ISBN: 1420027328
Category : Mathematics
Languages : en
Pages : 930
Get Book Here
Book Description
Serving as an all-in-one guide to the entire field of coatings technology, this encyclopedic reference covers a diverse range of topics-including basic concepts, coating types, materials, processes, testing and applications-summarizing both the latest developments and standard coatings methods. Take advantage of the insights and experience of over
Author: Janglin Chen
Publisher: Springer
ISBN: 9783540795681
Category : Technology & Engineering
Languages : en
Pages : 2700
Get Book Here
Book Description
This handbook offers a comprehensive description of the science, technology, economic and human interface factors associated with the displays industry. With expert contributions from over 150 international display professionals and academic researchers, it covers all classes of display device and discusses established principles, emergent technologies, and particular areas of application.
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
Get Book Here
Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Author: 3M Company
Publisher: 3m Company
ISBN:
Category : 3M Company
Languages : en
Pages : 246
Get Book Here
Book Description
A compilation of 3M voices, memories, facts and experiences from the company's first 100 years.
Author: Terry C. Edwards
Publisher: John Wiley & Sons
ISBN: 1118936175
Category : Technology & Engineering
Languages : en
Pages : 688
Get Book Here
Book Description
Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.
Author:
Publisher:
ISBN:
Category : Plastics
Languages : en
Pages : 318
Get Book Here
Book Description
Author: Amit Bandyopadhyay
Publisher: CRC Press
ISBN: 1498766706
Category : Technology & Engineering
Languages : en
Pages : 547
Get Book Here
Book Description
The field of additive manufacturing has seen explosive growth in recent years due largely in part to renewed interest from the manufacturing sector. Conceptually, additive manufacturing, or industrial 3D printing, is a way to build parts without using any part-specific tooling or dies from the computer-aided design (CAD) file of the part. Today, mo
