Practical Guide to the Packaging of Electronics, Second Edition PDF Download
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Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1439870926
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated, includes more detail where needed, and provides additional segments for clarification. This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest. Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities. By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 9780824708658
Category : Technology & Engineering
Languages : en
Pages : 226
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Book Description
Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems. Practical Guide to the Packaging of Electronics discusses Packaging/enclosure design and reliability Thermal, junction-to-case, and contact interface resistance Direct and indirect flow system design Fin design and fan selection Vital elements of shock and vibration Thermal stresses and strains in the design and analysis of mechanically reliable systems Reliability models and system failure The selection of engineering software to facilitate system analysis Design parameters in an avionics electronics package Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 1020
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Book Description
Charles A. Harper's 2nd edition on designing and manufacturing all the major types of electronic systems is now double the size of the 1st edition. It draws upon the expertise of a dozen experts to make sense of this highly interdisciplinary field
Author: Ken Kuang
Publisher: Springer Science & Business Media
ISBN: 0387473246
Category : Science
Languages : en
Pages : 253
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Book Description
Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.
Author: Mckeown
Publisher: CRC Press
ISBN: 9780824770334
Category : Technology & Engineering
Languages : en
Pages : 382
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Book Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Author: Bryan R. Fischer
Publisher: CRC Press
ISBN: 1439863253
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
Use Tolerance Analysis Techniques to Avoid Design, Quality, and Manufacturing Problems Before They Happen Often overlooked and misunderstood, tolerance analysis is a critical part of improving products and their design processes. Because all manufactured products are subject to variation, it is crucial that designers predict and understand how these changes can affect form, fit, and function of parts and assemblies—and then communicate their findings effectively. Written by one of the developers of ASME Y14.5 and other geometric dimension and tolerancing (GD&T) standards, Mechanical Tolerance Stackup and Analysis, Second Edition offers an overview of techniques used to assess and convey the cumulative effects of variation on the geometric relationship between part and assembly features. The book focuses on some key components: it explains often misunderstood sources of variation and how they contribute to this deviation in assembled products, as well as how to model that variation in a useful manner. New to the Second Edition: Explores ISO and ASME GD&T standards—including their similarities and differences Covers new concepts and content found in ASME Y14.5-2009 standard Introduces six-sigma quality and tolerance analysis concepts Revamps figures throughout The book includes step-by-step procedures for solving tolerance analysis problems on products defined with traditional plus/minus tolerancing and GD&T. This helps readers understand potential variations, set up the problem, achieve the desired solution, and clearly communicate the results. With added application examples and features, this comprehensive volume will help design engineers enhance product development and safety, ensuring that parts and assemblies carry out their intended functions. It will also help manufacturing, inspection, assembly, and service personnel troubleshoot designs, verify that in-process steps meet objectives, and find ways to improve performance and reduce costs.
Author: M. Bradford Clifton
Publisher: CRC Press
ISBN: 1482276348
Category : Business & Economics
Languages : en
Pages : 282
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Book Description
Compiling practical recommendations gleaned from more than 20 years of professional experience, Target Costing: Market Driven Product Design provides numerous examples from field authorities that illustrate valuable concepts and approaches employed in the application of target costing to large-scale manufacturing operations. The authors discuss set
Author: Raymond G. Bayer
Publisher: CRC Press
ISBN: 9781420030969
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
A modern presentation of approaches to wear design, this significantly revised and expanded second edition offers methods suited for meeting specific wear performance requirements, numerous design studies highlighting strategies for use with different tribological elements and mechanical systems, proven tactics for resolving wear-related problems,
Author: Raymond J. Bayer
Publisher: CRC Press
ISBN: 9780203021798
Category : Science
Languages : en
Pages : 424
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Book Description
Written by a tribological expert with more than thirty years of experience in the field, Mechanical Wear Fundamentals and Testing, Second Edition compiles an extensive range of graphs, tables, micrographs, and drawings to illustrate wear, friction, and lubrication behavior in modern engineering applications. The author promotes a clear understandin
Author: Lawrence W. Fisher, P.E.
Publisher: CRC Press
ISBN: 9780824740474
Category : Technology & Engineering
Languages : en
Pages : 616
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Book Description
Insufficient knowledge, time limitations, and budget constraints often result in poor material selection and implementation, which can lead to uncertain performance and premature failure of mechanical and electro-mechanical products. Selection of Engineering Materials and Adhesives is a professional guide to choosing the most appropriate materials and adhesives for product development applications from the onset. This text emphasizes material properties and classifications, fabrication and processing considerations, performance objectives, and selection based on specific application requirements, such as frequency of use (duty cycle) and operating environment. Each chapter focuses on a particular material family, covering ferrous and non-ferrous metals, including steels, cast-iron, aluminum, and titanium, as well as plastics such as PVC, acrylics, and nylons. Unique to this book on material selection, the final chapter discusses critical aspects of adhesives, including cure methods and joint configurations. Selection of Engineering Materials and Adhesives presents materials that are most often used for selection processes and applications in product development. This book is an ideal text for senior level undergraduate or graduate courses in mechanical engineering and materials science as well as recent graduates or managers who are tasked with the daunting job of selecting a material for a new application or justifying a long-used material in a specific application. It embodies the author's own experience and lectures on this subject, taught at UCLA Extension, and provides students as well as practicing engineers the tools to systematically select the most appropriate materials and adhesives for their design work.
