Post-irradiation examination of thin end caps and zircaloy-4 inserts from bundle xna, exp-NRU-112 PDF Download
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Author: J. R. Kelm
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
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Author: J. R. Kelm
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ISBN:
Category :
Languages : en
Pages : 0
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Author: J. P. Lambert
Publisher:
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Category :
Languages : en
Pages : 0
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Author: Mackenzie L. Davis
Publisher: McGraw Hill Professional
ISBN: 0071713859
Category : Technology & Engineering
Languages : en
Pages : 1301
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Book Description
An In-Depth Guide to Water and Wastewater Engineering This authoritative volume offers comprehensive coverage of the design and construction of municipal water and wastewater facilities. The book addresses water treatment in detail, following the flow of water through the unit processes and coagulation, flocculation, softening, sedimentation, filtration, disinfection, and residuals management. Each stage of wastewater treatment--preliminary, secondary, and tertiary--is examined along with residuals management. Water and Wastewater Engineering contains more than 100 example problems, 500 end-of-chapter problems, and 300 illustrations. Safety issues and operation and maintenance procedures are also discussed in this definitive resource. Coverage includes: Intake structures and wells Chemical handling and storage Coagulation and flocculation Lime-soda and ion exchange softening Reverse osmosis and nanofiltration Sedimentation Granular and membrane filtration Disinfection and fluoridation Removal of specific constituents Drinking water plant residuals management, process selection, and integration Storage and distribution systems Wastewater collection and treatment design considerations Sanitary sewer design Headworks and preliminary treatment Primary treatment Wastewater microbiology Secondary treatment by suspended and attached growth biological processes Secondary settling, disinfection, and postaeration Tertiary treatment Wastewater plant residuals management Clean water plant process selection and integration
Author: U.S. Nuclear Regulatory Commission
Publisher:
ISBN:
Category : Nuclear energy
Languages : en
Pages : 950
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Author: Mackenzie L. Davis
Publisher: McGraw Hill Professional
ISBN: 1260132285
Category : Technology & Engineering
Languages : en
Pages : 1349
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A Fully Updated, In-Depth Guide to Water and Wastewater Engineering Thoroughly revised to reflect the latest advances, procedures, and regulations, this authoritative resource contains comprehensive coverage of the design and construction of municipal water and wastewater facilities. Written by an environmental engineering expert and seasoned academic, Water and Wastewater Engineering: Design Principles and Practice, Second Edition, offers detailed explanations, practical strategies, and design techniques as well as hands-on safety protocols and operation and maintenance procedures. You will get cutting-edge information on water quality standards, corrosion control, piping materials, energy efficiency, direct and indirect potable reuse, and more. Coverage includes: • The design and construction processes • General water supply design considerations • Intake structures and wells • Chemical handling and storage • Coagulation and flocculation • Lime-soda and ion exchange softening • Reverse osmosis and nanofiltration • Sedimentation • Granular and membrane filtration • Disinfection and fluoridation • Removal of specific constituents • Water plant residuals management, process selection, and integration • Storage and distribution systems • Wastewater collection and treatment design considerations • Sanitary sewer design • Headworks and preliminary treatment • Primary treatment • Wastewater microbiology • Secondary treatment by suspended growth biological processes • Secondary treatment by attached growth and hybrid biological processes • Tertiary treatment • Advanced oxidation processes • Direct and indirect potable reuse
Author: King-Ning Tu
Publisher: Springer Science & Business Media
ISBN: 0387388923
Category : Technology & Engineering
Languages : en
Pages : 376
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The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Author: Amit Bandyopadhyay
Publisher: CRC Press
ISBN: 1498766706
Category : Technology & Engineering
Languages : en
Pages : 547
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Book Description
The field of additive manufacturing has seen explosive growth in recent years due largely in part to renewed interest from the manufacturing sector. Conceptually, additive manufacturing, or industrial 3D printing, is a way to build parts without using any part-specific tooling or dies from the computer-aided design (CAD) file of the part. Today, mo
Author: Keith Brindley
Publisher: Elsevier
ISBN: 1483105377
Category : Technology & Engineering
Languages : en
Pages : 354
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Book Description
Newnes Electronics Assembly Handbook
Author: Chretien de Troyes
Publisher: Yale University Press
ISBN: 0300038380
Category : Poetry
Languages : en
Pages : 244
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Book Description
A twelfth-century poem by the creator of the Arthurian romance describes the courageous exploits and triumphs of a brave lord who tries to win back his deserted wife's love
Author: John Hock Lye Pang
Publisher: Springer Science & Business Media
ISBN: 1461404630
Category : Technology & Engineering
Languages : en
Pages : 184
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Book Description
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
